Dispensing Equipment
Dymax manual and automated fluid dispense systems and spray valves are easily integrated into existing manufacturing processes for easy application of coatings, lubricants, or masking resins.
Encapsulating
Light-Curable Encapsulants for Protection of Printed Circuit Board Components
Dymax light-curable encapsulants offer electronic protection for bare die, wire bonds, chip-on-board, and integrated circuits. Upon exposure to UV or LED light our printed-circuit board (PCB) encapsulants cure tack-free in seconds and offer superior protection on both flexible and rigid PCB platforms.
Secondary curing mechanisms are available in some Dymax products to address shadow areas. Dymax dual-cure materials cure upon exposure to light and feature a secondary ambient moisture cure capability. Dymax Multi-Cure® materials cure upon exposure to light and offer a secondary heat cure capability.
Electronic Encapsulation Applications Include:
- Chip-On-Board, Flex, and Glass
- Bare Die Encapsulating
- IC to Flex Circuit Attachment and Bonding
- Glob Top Encapsulation
- Circuit Coating
- Wire Bonding
Features
- Cure using LED or UV/Visible light
- Dual-cure - secondary moisture cure capability (some products)
- Multi-Cure - secondary heat cure for shadow areas (some products)
- Fast cure increases throughput and minimizes handling
- High coverage and low VOCs
- Halogen free
- Low stress under thermal cycling
- Electrically insulating
- Simple dispense eliminates costs of complex dispensing system maintenance
- No solvents added
Encapsulating
Encapsulating
Dymax 9000-series encapsulants cure tack-free in seconds upon exposure to UV/Visible light for superior protection of components on both flexible and rigid printed circuit board platforms. They are ideal for chip on board, flex, and glass, glob tops, bare die, integrated circuits, and wire tacking and bonding.
Product Number
Product Description
Regional Availability
9037-F
Resilient chip encapsulant and wire bond adhesive designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This product cures with UV/Visible light and features a secondary heat cure to address shadow areas. This material has great flexibility, provides high moisture and thermal resistance, and fluoresces blue.
9309-SC
Color-changing reinforcement adhesive for edgebonding and CSP reinforcement. This product cures upon exposure to UV/Visible light to quickly ruggedize PCB components.
Product Number
Product Description
Regional Availability
9008
UV-curable adhesive for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. This encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces and remains flexible to -40°C, making it ideal for COF applications.
9101
UV light-curable encapsulant with secondary ambient moisture cure capability. This product is resilient, flexible, and offers good moisture and thermal resistance.
9102
Flexible chip-encapsulant material designed to cure with UV-light and secondary ambient moisture cure for shadow areas. This product has high CTE/low Tg for lower stress on components and offers good moisture and thermal resistance.
9103
This clear encapsulant cures first upon exposure to UV light and then over time with ambient moisture. Bonds well to many substrates and has high CTE/low Tg for lower stress on components.
9001-E-V3.1
Light and heat-curable encapsulant & potting resin for electronic assembly and circuit boards where enhanced moisture and thermal cycling, and abrasion resistance are required. This material provides optimal coverage over difficult circuit geometries and minimizes stress on delicate wire bonds.
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