Dispensing Equipment
Dymax manual and automated fluid dispense systems and spray valves are easily integrated into existing manufacturing processes for easy application of coatings, lubricants, or masking resins.
Potting
Potting Compounds for PCBs
Protect electronic components and circuitry with Dymax PCB potting compounds. Our potting compounds with Multi-Cure® shadow cure technology cure in 10-30 seconds. The ability to cure with UV or LED light eliminates the need for fixtures, jigs, racks, and ovens, increasing space and lowering total inventory costs.
Dymax potting materials provide translucent bonds with excellent adhesion to engineered plastics and are ideal for potting electronics, connectors, thermal switches, and sensors, as well as for tamper-proofing. Electronics and PCB potting compounds offer high adhesion to metal, glass, ceramic, and many phenolic, filled, and thermoset plastics and are ideal for bridge bonding.
Features
- Cures with UV /Visible light
- Multi-Cure - secondary heat or activator cure
- Halogen free
- Tack-free cure in 10-30 seconds
- High adhesion to wide variety of substrates
- Solvent free
Potting
Potting
Light-Curable Potting Compounds for Electronic Components
Product Number
Product Description
Regional Availability
1040-M
MD® 1040-M autoclave resistant adhesive for medical instruments and assembly. Bond, pot or encapsulate medical devices that require repeated sterilization for 100 cycles or more.
Product Number
Product Description
Regional Availability
921-GEL
Rapid rigid adhesive and shallow potting (0.25 in/6mm) for a wide variety of substrates. This material is formulated to cure primarily with UV/Visible light and includes a secondary heat or activator cure function in applications with shadow areas.
921-T
High-strength resin for rigid adhesive bonds or potting of a wide variety of substrates. This resin cures clear and deep. This product can be cured with UV light, and shadow areas can be cured with heat.
921-VT
High-strength resin cures clear and deep. Suitable for when rigid adhesive bonds and potted areas are desired. This product cures with UV-light and heat or activator cure for shadow areas.
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