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Multi-Cure®

9001-E-V3.1

Resilient Encapsulant & Potting Resin for Electronic Assembly & Circuit Boards


Dymax Multi-Cure® 9001-E-V3.1 encapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. The product provides optimal coverage over difficult circuit geometries. This encapsulating material has high ionic purity, is solvent-free, and isocyanate free. This encapsulant has been engineered to have a low modulus and low Tg to minimize stress on delicate wire bonds. Material exposed to light will cure in seconds, while any shadowed areas will cure upon heat exposure. 

9001-E-V3.1 encapsulant is especially well suited for chip-on-board, chip-on-flex, multi-chip modules, as well as wire bonding.

Dymax materials are solvent-free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.

Multi-Cure® 9001-E-V3.1 is in full compliance with the RoHS2 Directives 2015/863/EU.

Features

  • UV/Visible light cure for fastest processing
  • Secondary heat cure for shadowed areas
  • One part formulation - no mixing
  • Isocyanate free
  • Solvent free,
  • Low Tg, low modulus for wire bonding

Typical Properties

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Property Values
Viscosity (nominal) 4,500 cP
Cured appearance Clear
Recommended substrates Ceramic; Lead frame; PCB; Flex; Silicon

Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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