Optoelectronics Assembly
Dymax optically clear, UV-curable adhesives for optical assembly and lens bonding include grades for VCSEL potting, lens fixturing, lens laminating, lens positioning, and fiber-optic assembly.
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Optical & Telecommunications
Adhesive Solutions for Optical & Telecommunications Electronics
Electronics across optical and telecommunications industries require specialized adhesives that deliver precise alignment, long-term clarity, and structural protection. Dymax light-curable materials support manufacturers building optoelectronic devices, optical modules, and telecom infrastructure by improving process speed, assembly accuracy, and environmental resistance.
Application solutions include:
Optoelectronics Assembly – Light-curable adhesives formulated to deliver low-shrink, low-stress bonds for high-precision alignment and secure fixturing of lenses, sensors, VCSELs, and other photonic components.
Telecom Electronics Assembly – Light-curable materials for bonding, encapsulating, and coating optical modules and PCBs to ensure signal integrity, mechanical reliability, and environmental durability in telecom electronics.
Features
- UV/Visible light cure
- Multi-Cure® products with UV light, heat, or activator cure capability
- Clear, flexible bonds
- One component materials require no mixing
- Fast fixture for immediate movement to the next process
- Formulations with no solvents added help address environmental concerns
