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LED-Curable Encapsulants for Microelectronic Component Protection

Encapsulation

Encapsulants for Microelectronic Component Protection

Encapsulants for Microelectronic Component Protection

Light-Curable Encapsulants for Protection of Printed Circuit Board Components

Product Number

Product Description

Regional Availability

9624
LIGHT-CAP 9624 is designed for rapid, room-temperature coating of LED arrays. This clear material forms an instant protective lens for high-intensity LEDs.
9-20558-REV-A
Flexible, high viscosity encapsulant and conformal coating material that bonds well to FPCs. This material cures upon exposure to UV/Visible light with a secondary heat-cure capability. UL V0 Flammability Rating.
9008
UV-curable adhesive for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. This encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces and remains flexible to -40°C, making it ideal for COF applications.
9101
UV light-curable encapsulant with secondary ambient moisture cure capability. This product is resilient, flexible, and offers good moisture and thermal resistance.
9103
This clear encapsulant cures first upon exposure to UV light and then over time with ambient moisture. Bonds well to many substrates and has high CTE/low Tg for lower stress on components.
9001-E-V3.1
Light and heat-curable encapsulant & potting resin for electronic assembly and circuit boards where enhanced moisture and thermal cycling, and abrasion resistance are required. This material provides optimal coverage over difficult circuit geometries and minimizes stress on delicate wire bonds.
9102
Flexible chip-encapsulant material designed to cure with UV-light and secondary ambient moisture cure for shadow areas. This product has high CTE/low Tg for lower stress on components and offers good moisture and thermal resistance.

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