Dispensing Equipment
Dymax manual and automated fluid dispense systems and spray valves are easily integrated into existing manufacturing processes for easy application of coatings, lubricants, or masking resins.
Encapsulation
Encapsulants for Microelectronic Component Protection
Protect microelectronic components with Dymax light-curable PCB encapsulants. The encapsulation materials cure in seconds when exposed to UV/Visible light and provide superior protection of flexible and rigid PCB platforms. Chip encapsulants also have excellent adhesion to flex circuit substrates such as polyimide and PET.
Additionally, LED encapsulation materials are available and are resistant to heat-induced yellowing and are optically clear.
Features
- Cure with LED or UV/Visible light
- Fast, tack free cure in seconds
- Secondary heat or moisture cure available
- One part formulation - no mixing
- Optically clear, no yellowing
- No solvents added
- Resistant to humidity and thermal shock
- Electrically insulating
- Room temperature ship and storage
Encapsulants for Microelectronic Component Protection
Encapsulants for Microelectronic Component Protection
Light-Curable Encapsulants for Protection of Printed Circuit Board Components
Product Number
Product Description
Regional Availability
9014
Room temperature stable encapsulant and wire bond adhesive with a secondary moisture cure. This product provides good moisture and corrosion protection of critical components found in electronic applications such as electric vehicle battery management systems.
9037-F
Resilient chip encapsulant and wire bond adhesive designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This product cures with UV/Visible light and features a secondary heat cure to address shadow areas. This material has great flexibility, provides high moisture and thermal resistance, and fluoresces blue.
Product Number
Product Description
Regional Availability
9008
UV-curable adhesive for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. This encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces and remains flexible to -40°C, making it ideal for COF applications.
9101
UV light-curable encapsulant with secondary ambient moisture cure capability. This product is resilient, flexible, and offers good moisture and thermal resistance.
9103
This clear encapsulant cures first upon exposure to UV light and then over time with ambient moisture. Bonds well to many substrates and has high CTE/low Tg for lower stress on components.
9624
Dymax 9624 is especially formulated for rapid, room-temperature coating of LED arrays and COB LED encapsulation. The material is well suited for instant forming of protective lenses for high-intensity LEDs and features a low nominal viscosity (120 cP) for thin coatings.
9001-E-V3.1
Light and heat-curable encapsulant & potting resin for electronic assembly and circuit boards where enhanced moisture and thermal cycling, and abrasion resistance are required. This material provides optimal coverage over difficult circuit geometries and minimizes stress on delicate wire bonds.
9-20558-REV-A
Flexible, high viscosity encapsulant and conformal coating material that bonds well to FPCs. This material cures upon exposure to UV/Visible light with a secondary heat-cure capability. UL 94 Flammability V-0 rating.
9102
Flexible chip-encapsulant material designed to cure with UV-light and secondary ambient moisture cure for shadow areas. This product has high CTE/low Tg for lower stress on components and offers good moisture and thermal resistance.
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