Encapsulants for Microelectronic Component Protection

Encapsulants for Microelectronic Component Protection

Light-Curable Encapsulants for Protection of Printed Circuit Board Components

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UV-curable adhesive for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. This encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces and remains flexible to -40°C, making it ideal for COF applications.
UV light-curable encapsulant with secondary ambient moisture cure capability. This product is resilient, flexible, and offers good moisture and thermal resistance.
Flexible chip-encapsulant material designed to cure with UV-light and secondary ambient moisture cure for shadow areas. This product has high CTE/low Tg for lower stress on components and offers good moisture and thermal resistance.
This clear encapsulant cures first upon exposure to UV light and then over time with ambient moisture. Bonds well to many substrates and has high CTE/low Tg for lower stress on components.
Dymax 9624 is especially formulated for rapid, room-temperature coating of LED arrays and COB LED encapsulation. The material is well suited for instant forming of protective lenses for high-intensity LEDs and features a low nominal viscosity (120 cP) for thin coatings.
Flexible, high viscosity encapsulant and conformal coating material that bonds well to FPCs. This material cures upon exposure to UV/Visible light with a secondary heat-cure capability. UL 94 Flammability V-0 rating.
Light and heat-curable encapsulant & potting resin for electronic assembly and circuit boards where enhanced moisture and thermal cycling, and abrasion resistance are required. This material provides optimal coverage over difficult circuit geometries and minimizes stress on delicate wire bonds.

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