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UV Adhesive Prevents Thermocouple Lift for Reliable Reflow Profiling
A case history exploring how adhesive bonding outperformed tape and solder in demanding reflow environments.
As printed circuit board (PCB) designs become denser and more complex, achieving accurate reflow profiling has never been more important. Temperature deviations during soldering can lead to issues such as cold joints, warpage, or component failure. To ensure consistent thermal performance, Rochester Institute of Technology (RIT) in collaboration with KIC Thermal, evaluated several thermocouple (TC) attachment methods for their impact on measurement reliability during lead-free reflow.
Through extensive multi-cycle testing, RIT found that Dymax 9037-F, a UV-curable adhesive, delivered the most accurate, repeatable, and mechanically stable results across all methods assessed.
Challenge
Reflow profiling depends on the quality of thermocouple attachment. Conventional methods, such as high-temperature solder, polyimide tape, and aluminum tape, each introduce process risks:
- Solder joints added thermal mass, introduced measurement lag, and sometimes cracked or detached during repeated cycles.
- Polyimide tape frequently developed air pockets, lifted during the liquidus phase, or unintentionally pulled components from their pads.
- Aluminum tape, even when framed with polyimide tape, struggled to maintain adhesion, causing component lifting on high-density boards.
These challenges prompted RIT’s research team to evaluate whether a UV-curable adhesive could provide a low-profile, stable alternative for attaching thermocouples to densely populated PCBs.
Solution
RIT performed controlled testing on identical HDI-style boards populated with components ranging from 01005 passives to QFNs and BGAs. Six thermocouples were placed on each board using various attachment methods, including three UV-curable adhesives.
Each board underwent 20 lead-free reflow cycles in a 10-zone oven, while a high-precision profiler recorded temperature data across all cycles. Post-reflow inspections evaluated bond integrity, component stability, and thermocouple placement quality.
Among the adhesives tested, Dymax 9037-F showed:
- Strong adhesion to solder mask surfaces
- Consistent bond strength through all 20 cycles
- A thin, low-mass profile ideal for accurate thermal measurement
- Clean, precise dispensing without interfering with adjacent components
Results
Exceptional Bond Integrity
Dymax 9037-F maintained a secure attachment through repeated thermal excursions without cracking, lifting, or degrading. Competing adhesives and tape-based methods required frequent rework or caused components to detach during reflow.
Reliable, Repeatable Temperature Measurements
Data collected over 20 cycles revealed highly consistent peak temperatures, staying within the thermocouple’s tolerance range. No thermal lag or measurement bias was observed, attributed to the adhesive’s minimal thermal mass and stable bond. Runs from each test day showed that once the oven reached equilibrium, temperature readings remained tightly clustered.
Simplified Process Integration
Unlike high-temperature soldering, UV application avoided thermal shock and did not require component removal. Dymax 9037-F cured within seconds under standard UV/Visible light, enabling fast, repeatable TC placement suitable for laboratory research and production environments alike.
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Download a copy of the white paper study: "Stuck on Precision: Adhesive Holds Thermocouple Tight."
*Type "thermocouple" into the Search box on the Resources Library page to access the paper.
Related Products
Check out the other Dymax products that work in conjunction with this one to create a complete solution
Product Number
Product Description
Regional Availability
9037-F
Resilient chip encapsulant and wire bond adhesive designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This product cures with UV/Visible light and features a secondary heat cure to address shadow areas. This material has great flexibility, provides high moisture and thermal resistance, and fluoresces blue.
Check out the other Dymax products that work in conjunction with this one to create a complete solution
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