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9200-W Series Adhesives & Encapsulants

9211-W

Low-Stress Plastic Bonding Adhesive for Camera Module Assembly


9211-W low-stress plastic bonding adhesive cures with UV/Visible light energy for ultra-fast bonding and sealing of camera module components found in consumer wearable devices.

This product forms excellent bonds to PC, LCP, ABS, and FR4 substrates and is specifically designed for CCM applications and camera module barrel fixtures.

One-component, RoHS compliant, and with no solvents added, 9211-W is a plastic bonding adhesive formulated without IBOA and with low-sensitizing ingredients to be as safe as possible when wearables are touching or close to the skin.

9211-W adhesive is in full compliance with RoHS directives 2015/863/EU.

For medical wearables assembly, see the Dymax 2000-MW series of biocompatible IBOA- and TPO-free adhesives.

Features

  • Free of IBOA (isobornyl acrylate), a known skin sensitizer
  • Cures in seconds with UV/Visible light
  • One-part formulation – no mixing
  • No solvents added

Typical Properties

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Property Values
Viscosity (nominal) 20,000 cP
Uncured appearance Colorless
Cured durometer hardness D63
Cured elongation at break 191%
Cured linear shrinkage 0.68%
Recommended substrates LCP, PC, ABS, FR4

Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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