501-E-REV-A Activator, when pre-applied to metallic, plated, ceramic, or glass substrates including printed circuit boards or PCBs, rapidly cures Multi-Cure® 600 series and 800 series structural adhesives and thermal interface materials in gaps from less than 1 mil to 20 mils.
Activator bonding increases efficiency, consistency, and reliability and provides broad tolerance of adhesive-to-activator ratios. Dymax metal bonding adhesives develop bond strengths up to 3,500 psi in 10 to 30 seconds between opaque surfaces when an adhesive activator is pre-applied to metal substrates.
Read more about the products that work with 501-E-REV-A:
The product is environmentally safe because it has no solvents added and ozone-depleting chemicals (ODCs). The low volatility of this product and its high flash point enhance safety in the workplace.
501-E-REV-A activator is in full compliance with the RoHS Directives 2015/863/EU.