Dispensing Equipment
Dymax manual and automated fluid dispense systems and spray valves are easily integrated into existing manufacturing processes for easy application of coatings, lubricants, or masking resins.
Camera Module
Light-Cure Adhesives For Camera Module Assembly
Dymax adhesives and light-curable materials are utilized for the assembly of camera modules found in smart connected devices, automobiles, as well as security and industrial camera systems. The materials form strong bonds that cure in seconds upon exposure to light energy, providing higher UPH and greater throughput at a lower cost.
The products have excellent adhesion to a variety of plastics and metals and are capable of withstanding harsh conditions like moisture, heat, and shock.
Applications:
• Bonding the camera lenses
• Fixturing the lens barrel to a lens holder
• Bonding the lens holders to the PCB (Active Alignment)
• Flexible PCB Reinforcement
• Bonding the IR filter to the lens holder
• Attaching the CCD or CMOS die to the PCB
Features
- Cure with LED or UV/Visible light
- Complete cure in seconds
- Withstand moisture, heat, and shock
- One part formulations - no mixing or diluting
- No solvents added
- Excellent adhesion to glass, Kapton, PMMA, ceramic, silicon, lead frame, flex circuit, FR-4, ABS, LCP
Light-Cure Adhesives For Camera Module Assembly
Light-Cure Adhesives For Camera Module Assembly
Conformal Coating
Product Number
Product Description
Regional Availability
3094-T-REV-A
Low-stress, low shrinkage plastic bonding adhesive cures with high-intensity UV/Visible light in seconds for rapid bonding and sealing of a variety of plastics. The adhesive is thixotropic and jet friendly for easy dispensing.
9801
LED or UV/Visible light and heat-curable camera module adhesive. This product has superior adhesion properties, moisture and thermal resistant, and meets stringent low-shrinkage requirements.
9803
9803 optical epoxy adhesive for camera module assembly cures with LED light, Ultraviolet light, or heat.
9309-SC
Color-changing reinforcement adhesive for edgebonding and CSP reinforcement. This product cures upon exposure to UV/Visible light to quickly ruggedize PCB components.
Product Number
Product Description
Regional Availability
9008
UV-curable adhesive for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. This encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces and remains flexible to -40°C, making it ideal for COF applications.
9101
UV light-curable encapsulant with secondary ambient moisture cure capability. This product is resilient, flexible, and offers good moisture and thermal resistance.
3094-GEL-REV-A
Low-stress plastic adhesive quickly bonds and seals a variety of plastics. This thixotropic and jet friendly material cures within seconds upon exposure to UV/Visible light.
9906-AA
Dymax 9906-AA is an active alignment epoxy adhesive that is heat and/or LED light-curable.
6-621
Metal bonding adhesive curable with UV/Visible light, heat, or pre-applied activator. Visible light can penetrate through many UV-blocked and colored plastics and glasses. Applications include coil winding, potting, as well as metal-to-glass bonding.
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