Dispensing Equipment
Dymax manual and automated fluid dispense systems and spray valves are easily integrated into existing manufacturing processes for easy application of coatings, lubricants, or masking resins.
Advanced Driver Assistance Systems (ADAS)
Light-Cure Encapsulants and Adhesives For ADAS
Dymax light-curable encapsulants, lens bonding adhesives, and form-in-place gaskets provide protection and stability to LiDAR sensors and camera modules in Advanced Driver-Assistance Systems (ADAS), contributing to driver safety, mobility, and connectivity.
Encapsulants shield cameras and sensors from changing environmental conditions. The materials display very low movement with temperature variations and have excellent humidity and thermal shock resistance.
Optical component positioning, lens bonding, and camera module adhesives exhibit low CTE and shrinkage for active alignment applications. They prevent movement and enable structural support and precise attachment of lenses and covers.
Form-in-place gaskets form tight seals to inhibit the penetration of air, chemicals, and gaseous substances and aid in secure component sealing.
The materials are one part, so no mixing is required, and viscosity is consistent, to help reduce processing time and work in progress. Applications include active alignment of LiDAR sensors, camera module assembly, glass and plastic cover lens bonding, and housing sealing.
Features
- UV/Visible light cure
- No solvents added
- Products with very low shrinkage
- Resistance to humidity and thermal shock
- One-part formulations - no mixing
- Low moisture absorption materials
- Secondary heat- or moisture-cure products for shadow areas
- Glass and plastic adhesives with low stress bonding capability
- Some formulations with fluorescing for Q.C. inspection
Light-Cure Encapsulants and Adhesives For ADAS
Light-Cure Encapsulants and Adhesives For ADAS
Dymax dual-cure active alignment adhesives ensure precise placement and reliability of critical ADAS optical components, cutting down on processing time and increasing driver safety.
Product Number
Product Description
Regional Availability
9801
LED or UV/Visible light and heat-curable camera module adhesive. This product has superior adhesion properties, moisture and thermal resistant, and meets stringent low-shrinkage requirements.
9037-F
Resilient chip encapsulant and wire bond adhesive designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This product cures with UV/Visible light and features a secondary heat cure to address shadow areas. This material has great flexibility, provides high moisture and thermal resistance, and fluoresces blue.
9803
9803 optical epoxy adhesive for camera module assembly cures with LED light, Ultraviolet light, or heat.
Product Number
Product Description
Regional Availability
9001-E-V3.1
Light and heat-curable encapsulant & potting resin for electronic assembly and circuit boards where enhanced moisture and thermal cycling, and abrasion resistance are required. This material provides optimal coverage over difficult circuit geometries and minimizes stress on delicate wire bonds.
9-20558-REV-A
Flexible, high viscosity encapsulant and conformal coating material that bonds well to FPCs. This material cures upon exposure to UV/Visible light with a secondary heat-cure capability. UL 94 Flammability V-0 rating.
9906-AA
Dymax 9906-AA is an active alignment epoxy adhesive that is heat and/or LED light-curable.
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