Telecom Assembly

Telecom electronics demand adhesives and coatings that ensure reliability in high-density, high-speed applications. Dymax light-curable materials are designed for bonding optical modules and protecting PCB assemblies under thermal, mechanical, and environmental stress. These materials offer precise placement, fast curing, and long-term performance—helping telecom manufacturers meet throughput goals while maintaining signal integrity and durability.

Key Product Capabilities

• Structural adhesives that bond optical modules with strength and precision
• Encapsulants that protect components and absorb mechanical shock
• Conformal coatings that extend board life and enhance long-term performance
• Specialized materials that maintain signal fidelity under environmental stress

Typical applications include optical module bonding, fiber-optic assembly, PCB encapsulation and coating, wire and chip protection, and reinforcement of critical electronic assemblies.