Dispensing Equipment
Dymax manual and automated fluid dispense systems and spray valves are easily integrated into existing manufacturing processes for easy application of coatings, lubricants, or masking resins.
Encapsulation
Encapsulants for Microelectronic Component Protection
Protect microelectronic components with Dymax light-curable PCB encapsulants. The encapsulation materials cure in seconds when exposed to UV/Visible light and provide superior protection of flexible and rigid PCB platforms. Chip encapsulants also have excellent adhesion to flex circuit substrates such as polyimide and PET.
Additionally, LED encapsulation materials are available and are resistant to heat-induced yellowing and are optically clear.
Features
- Cure with LED or UV/Visible light
- Fast, tack free cure in seconds
- Secondary heat or moisture cure available
- One part formulation - no mixing
- Optically clear, no yellowing
- No solvents added
- Resistant to humidity and thermal shock
- Electrically insulating
- Room temperature ship and storage
Encapsulants for Microelectronic Component Protection
Encapsulants for Microelectronic Component Protection
Light-Curable Encapsulants for Protection of Printed Circuit Board Components
Product Number
Product Description
Regional Availability
9037-F
Resilient chip encapsulant and wire bond adhesive designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This product cures with UV/Visible light and features a secondary heat cure to address shadow areas. This material has great flexibility, provides high moisture and thermal resistance, and fluoresces blue.
9014
Room temperature stable encapsulant and wire bond adhesive with a secondary moisture cure. This product provides good moisture and corrosion protection of critical components found in electronic applications such as electric vehicle battery management systems.
Product Number
Product Description
Regional Availability
9001-E-V3.1
Light and heat-curable encapsulant & potting resin for electronic assembly and circuit boards where enhanced moisture and thermal cycling, and abrasion resistance are required. This material provides optimal coverage over difficult circuit geometries and minimizes stress on delicate wire bonds.
9-20558-REV-A
Flexible, high viscosity encapsulant and conformal coating material that bonds well to FPCs. This material cures upon exposure to UV/Visible light with a secondary heat-cure capability. UL 94 Flammability V-0 rating.
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