Press Releases

Press Releases

Find the latest Dymax press releases to learn about global and local company initiatives.

Showing 162 results

Introducing Dymax BlueWave® MX-MIM Machine Interface Module

Dymax introduces the newest edition of its line of light-curing systems, the BlueWave MX-MIM Machine Interface Module.

November 07, 2019

Pathway to Manufacturing Program Sponsored by Dymax Corporation

Obtain the Skills Needed to Enter a Career in Manufacturing

November 06, 2019

Dymax Corporation Recognized by Inc. 5000

Dymax has been identified by Inc. Magazine as one of the 5,000 fastest-growing private companies in the country for the ninth time.

August 20, 2019

Dymax Asia Pacific Pte Ltd Recognized as Leading Corporation in Singapore

Dymax Asia Pacific Pte Ltd, has received the Singapore 1000 and Singapore SME 1000 award in its annual ranking of best companies in 2020.

July 01, 2020

Dr. Aysegul Kascatan Nebioglu to Present at IPC/APEX Expo 2020

Dr. Aysegul Kascatan Nebioglu, Senior R&D Manager of the adhesives team at Dymax Corporation, will present at the IPC/APEX Expo that will take place on February 4-6, 2020 in San Diego, CA.

January 24, 2020

Dymax Corporation Celebrates 40th Anniversary

July 13, 2020 - Over the past forty years, Dymax Corporation has built a tradition of excellence providing manufacturers with adhesive chemistry and equipment solutions for a variety of applications within its core markets

July 13, 2020

Dymax Responds Quickly to Ventilator Shortage with Fast-Curing Medical Adhesives

Medical device manufacturers worldwide continue to face extraordinary challenges to rapidly deliver emergency medical supplies with increased supply and demand from COVID19.

April 14, 2020

Introducing MD® 250-CTH Cationic Epoxy for Medical Device Assembly

Dymax Corporation expands its range of MD Medical Device Adhesives with the introduction of MD 250-CTH, a new cationic epoxy.

June 01, 2020

Introducing Multi-Cure® 9037-F Encapsulant for Printed Circuit Board Assembly

Dymax expands its range of encapsulant materials with the introduction of Multi-Cure 9037-F for a variety of glob-top, chip-on-board, chip-on-flex, chip-on-glass, and wire-tacking/bonding applications.

July 01, 2020
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