Resilient Light-Curable Electronic Assembly/Circuit Board Encapsulant

Multi-Cure^® 9001-E-V3.0 is a performance grade with improved moisture and thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to LED, longwave UV, and visible light, this material is environmentally resistant with good ionic and electrical properties. The encapsulant has a secondary heat cure for applications with shadow areas. This material displays excellent adhesion to PC boards and electronic components and is especially well-suited for chip-on-board, chip-on-flex, and multi-chip modules.

Dymax materials have no solvents added. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.

Multi-Cure^® 9001-E-V3.0 is in full compliance with the RoHS2 Directives 2015/863/EU.