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Multi-Cure®

9001-E-V3.0

Resilient Light-Curable Electronic Assembly/Circuit Board Encapsulant


Multi-Cure® 9001-E-V3.0 is a performance grade with improved moisture and thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to LED, longwave UV, and visible light, this material is environmentally resistant with good ionic and electrical properties. The encapsulant has a secondary heat cure for applications with shadow areas. This material displays excellent adhesion to PC boards and electronic components and is especially well suited for chip-on-board, chip-on-flex, and multi-chip modules.

Dymax materials contain no nonreactive solvents. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.

Multi-Cure® 9001-E-V3.0 is in full compliance with the RoHS2 Directives 2015/863/EU.

Features

  • UV/Visible light cure for fastest processing
  • Multi-Cure - secondary heat cure for shadowed areas
  • One part formulation - no mixing
  • Low Tg, low modulus for wire bonding
  • Solvent free
  • Isocyanate free
  • Compliant with RoHS directives 2015/863/EU

Typical Properties

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Property Values
Viscosity (nominal) 400 cP
Cured appearance Clear
Recommended substrates Ceramic; Lead frame; PCB; Flex; Silicon

Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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