2000 MW Medical Adhesive

2022-MW

Low Water Absorption Encapsulant, Coating and Bonding Adhesive for Wearable Medical Devices


Dymax 2022-MW is a versatile general bonding adhesive, coating, and encapsulant with low water absorption and minimized water ingression. It offers extremely low water absorption of 0.5% making it ideal for the assembly or encapsulation of electronic wearable medical device components.

Formulated without IBOA, a known skin irritant and TPO, a material of concern, 2022-MW is compliant with ISO 10993-5 for cytotoxicity standards. This classification makes it an ideal material for wearable medical devices where proximity to skin for extended periods of time is a concern.

2022-MW is recommended for use as a coating or encapsulant on RFID chips or sensors housing assemblies, and single- or multi-use medical devices where moisture ingression is a concern. It bonds well to stainless steel, aluminum, glass, and printed circuit boards.   

This material is solvent free and cures in seconds upon exposure to broad-spectrum UV or 365 nm LED light.

Example of Dymax 2022-MW medical wearables adhesive used for continuous glucose monitoring

Features

  • Low water absorprtion: 0.5%
  • Biocompatible 10993-5 cytotoxicity standards
  • IBOA Free (designed without isobornyl acrylate)
  • UV/Broad Spectrum and LED curable at 365nm
  • Compliant with RoHS directives 2015/863/EU
  • Superior adhesion to a wide range of substrates
  • Solvent free

Typical Properties

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Property Values
Viscosity, cP (20rpm) (nominal) 700cp
Cured durometer hardness D60
Cured elongation at break 8%
Recommended substrates: SS, Aluminum, Glass, SAN, PU, PI, PETG, PC, ABS

Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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