Light-Curable Materials for Automotive Camera Module Assembly

Automotive CMOS Assembly

Automotive Camera Module Assembly

Faster, Stronger Bonds for Camera Modules

Dymax light-curable adhesives are ideal for the assembly of camera modules found in automobiles and other vehicles. Our one-part solvent-free adhesives cure in seconds upon exposure to light, providing greater product yields in much shorter assembly times.  They provide excellent adhesion to substrates typically used in the manufacture of camera modules. The adhesives can withstand harsh conditions like moisture and shock, which automobiles are often exposed to, and also exhibit very low shrinkage.

Applications
Camera module to board bonding
Headlamp & fog light lamp lens to reflector housing
Polycarbonate headlamp assemblies

Features
UV/Visible light cure
Passed Ford WSB-M11P28-B
Passed GM 6432M

 

Applications:
CCM assembly
Plastics assembly
Household appliance assembly

Features:
Low-stress
Low shrinkage
Bonds LCP, PC, PU and PS
Cures in seconds upon exposure to high-intensity UV/Visible light

 

Applications:
CCM assembly
Plastic assembly
Household appliance assembly

Features:
Low shrinkage
Low-stress
Bonds LCP, PC, PU, and PS
Cures in seconds upon exposure to high-intensity UV/Visible light

 

Applications:
Metal-to-glass bonding
Coil winding
Potting

Features:
UV/Visible light cure
Secondary heat cure
Activator cure
Bonds multiple substrates
Hard and clear bonds

 

Applications:
Flex circuit bonding/attachment
Chip-on-flex
Chip-on-board

Features:
Halogen-free
UV/Visible light cure
One part, no mixing is required
Low VOC
Solvent free, Isocyanate free
Thixotropic for precise dispensing on ICs
Highly moisture resistant
Low dielectric constant for high frequency applications
Low modulus for minimal stress
Remains flexible at low temperatures

 

Applications:
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding

Features:
Halogen-free
UV/Visible light cure
Secondary moisture cure
Flexible encapsulant
Low VOC
Solvent free, Isocyanate free
Shadowed area performance
Moisture and thermal resistance
High CTE/low Tg for lower stress on components

 

Applications:
Reinforcing fine pitch or leadless components on printed circuit boards
Shock absorption
Underfill alternative

Features:
UV/Visible light cure
Halogen-free
Solvent free
Blue-to-clear upon exposure to UV/Visible light
Tack-free surface after cure
Compatible with needle or jet dispensing equipment
Very low VOCs
Adhesion to various PCB substrates
Reduces stress on board components
Highly thixotropic for minimal movement after dispense

 

Applications:
Advanced Driver Assistance Systems (ADAS)
Camera Module Placement
Lidar
Active Alignment
Recommended substrates include LCP, PCB, PPS, and FPC

Features:
UV, heat, or UV/heat cure
Secondary heat cure for shadowed areas
Moisture and thermal cycle resistance
Exceptionally Low shrinkage
Solvent free
High Tg and low CTE
One part, no mixing required
Cold store/cold ship