Read all about it! The Dymax newsroom keeps you up-to-date on the latest light-cure technology developments.

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Dymax Newsroom

Read About the Newest Light-Curing Products, Services, and Media

The Dymax newsroom is intended to keep visitors informed of our latest developments in light-cure technology. Whether it’s new products, media, blog posts, or employees, we’ll update our site frequently and make sure you know what’s going on. Tell us what you think and what topics are of interest to you.

Latest News

Introducing Dymax BlueWave® MX-MIM Machine Interface Module
Dymax Corporation introduces the newest edition of its line of light-curing systems, the BlueWave® MX-MIM Machine Interface Module. Designed for machine automation builders, the BlueWave MX-MIM easily incorporates into automated light-curing systems and can utilize PROFINET or EtherNet/IP network protocols to control MX-series emitters.

Pathway to Manufacturing Program Sponsored by Dymax Corporation
We are sponsoring a free two-week Pathway to Manufacturing program in partnership with Northwestern CT Community College located in Winsted, CT. Classes begin November 18th, 2019 and last for two weeks. After completing the coursework, students will have the necessary skills needed to enter a career in manufacturing at a higher wage.

Dymax Asia Pacific Pte Ltd. IATF 16949 Letter of Conformity
Dymax Asia Pacific Pte Ltd. has received an IATF 16949 Letter of Conformity for its Quality Management System (QMS) for Design and Manufacture of Light/Moisture Curable Adhesives.

Dymax Asia Pacific Pte Ltd. Recognized by Dun & Bradstreet – Winner of D&B Business Eminence Award
Dymax Corporation has been awarded one of the winners of the Dun & Bradstreet Business Eminence Award for the Dymax Asia Pacific Pte Ltd. location.

Introducing Dymax 9014, Room‐Temperature‐Stable Encapsulant and Wire Bonding Material – Features Secondary Moisture Cure for Shadow Areas on PCBs
Dymax introduces the newest product in its encapsulant portfolio, Dymax 9014, a dual‐cure formulation, that first cures using UV light and then secondarily with a moisture cure for shadow areas on printed circuit boards.

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