Aerospace and Defense Avionics

Aerospace and Defense Avionics

Light-Curable Materials for Aerospace and Defense Avionics

The aerospace and defense avionics industry continues to develop technologies to improve imaging sensors used for ground proximity, aircraft health management, surveillance, missile guidance systems, and harsher conditions that PCB assemblies must withstand. Dymax light-curable formulations are designed to address the growing industry challenges and demands for new technologies in this sector.

Dymax’s broad range of one-part, solvent-free electronic materials cure in seconds upon exposure to UV/Visible light. These light-curable materials are used in a wide variety of applications for circuit protection and electronic assembly. The products are electrically insulating and are used in various operations including conformal coating, encapsulation, bonding, thermal management, ruggedizing, camera module bonding, masking, and shallow potting. IPC approved, MIL-I-46058C, and UL listed self-extinguishing grades are available. Most products are available in multiple-viscosity grades, so the material flow may be tailored to the individual application.

  • Light-cure conformal coatings can be applied over the entire PCB surface or in discreet areas to provide complete protection from harsh environments or chemical exposure. Multiple shadow-area formulations, including dual-cure, are available.
  • UV encapsulants protect components on rigid or flexible boards to -40°C.
  • Electronic peelable maskants are designed for manual or fully automated masking of printed circuit boards prior to wave solder or reflow operations.
  • One-part potting compounds can achieve full cure in seconds and dramatically reduce cycle times and costs.
  • UV-curable thermally conductive adhesives cure in seconds with light, heat, or activator to effectively transfer heat to keep components cool. They may be paired with Dymax LED protection potting materials to enhance LED performance.
Halogen-Free Dymax Products Dymax has halogen-free formulations. We offer a wide variety of halogen-free conformal coatings, adhesives, encapsulants, and potting materials.

Aerospace and Defense Avionics

Applications:
CCM assembly; Plastics assembly; Household appliance assembly

Features:
Low-stress; Low shrinkage; Bonds LCP, PC, PU and PS; Cures in seconds upon exposure to high-intensity UV/Visible light

Applications:
CCM assembly; Plastic assembly; Household appliance assembly

Features:
Low shrinkage; Low-stress; Bonds LCP, PC, PU, and PS; Cures in seconds upon exposure to high-intensity UV/Visible light

Applications:
Used with Dymax 600 and 800 series structural bonding adhesives for fast structural bonding; High strength bonds form to metal, painted/coated metal, plated and surface treated metal, ferrite, ceramic, glass, wood, and thermoset plastic substrates

Features:
ODC-free; Excellent degreasing and wetting properties; Elimination of heat curing and other delays in curing; Broad tolerance of adhesive-to-activator ratios

Applications
Metal-to-Glass bonding; Coil winding; Potting

Features
UV/Visible light cure; Secondary heat cure; Activator cure; Bonds multiple substrates; Hard and clear bonds

Applications:
Sealing critical automotive components and assemblies

Features:
LED curable in seconds upon exposure to 385 or 405 nm wavelength light; Encompass® technology; Deep section cure; Fast curing

Applications:
Metal frame bonding; Metal-to-stone assembly; Loudspeaker hardware assembly; D.C. motor assembly; Magnet bonding

Features:
Activator cure; Bond dissimilar substrates; No cure until assembly for precise alignment of parts; Tough, durable bonds

Applications:
Masking for conformal coating applications; Masking for wave solder or reflow processes

Features:
Blue color for easy visual inspection; Halogen free; UV/Visible light cure in seconds; Exceptionally thixotropic for manual or automated dispensing; Compatible with gold and copper connector pins; Silicone free; Solvent free

Applications:
Conformal coating

Features:
Halogen-free; Solvent free; UV/Visible light cure in seconds; Secondary heat cure for shadowed areas; Blue fluorescing; Isocyanate free; Low VOCs; One part, no mixing required; Suitable for most types of spray equipment; Medium viscosity, designed to enhance wetting of leads; Low modulus for thermal cycling performance; MIL-I-46058C listed; IPC-CC-830-B approved; UL recognized

Applications:
Conformal coating; Chip encapsulation; Wire bonding

Features:
UV/Visible light cure; Secondary heat cure; Thixotropic; High viscosity coating

Applications:
Masking for wave solder or reflow processes; Masking for conformal coating applications

Features:
Halogen-Free; UV/Visible light cure in seconds; Highly thixotropic for manual or automated dispensing onto difficult components; Silicone free; Solvent free; Low VOCs; Blue fluorescing for black light inspection; Medium adhesion for peeling

Applications:
Masking for solvent based conformal coating applications; Masking for wave solder or reflow processes

Features:
Compatible with gold and copper connector pins; One layer protection; UV/Visible light curing; Visible pink color in uncured state; Non-slumping when dispensed; Halogen free – pending; Resistance to solvent based conformal coatings and primers; Thixotropic for manual or automated dispensing; Fast curing; Tack free with depth of cure up to 0.5″; Lower shrinkage; Silicone free

Applications:
Wire Tacking; Bonding Jumper Wires; PCB Repair

Features:
UV/Visible Light Cure; Secondary Heat Cure; High Viscosity for Optimal Coverage of Wires; One Part, No Mixing Required; Faster UV Fixture Time; Solvent Resistant

Applications:
Chip-on-board; Chip-on-flex; Multi-chip modules; Chip-on-glass; Wire bonding; Bare die encapsulation

Features:
UV/Visible light cure for fastest processing; Halogen-free; LED light-curable; Secondary heat cure for shadowed areas; One part, no mixing is required; Solvent free, Isocyanate free; Low Tg, low modulus for wire bonding

Applications:
Flex circuit bonding/attachment; Chip-on-flex; Chip-on-board

Features:
Halogen-free; UV/Visible light cure; One part, no mixing is required; Low VOC; Solvent free, Isocyanate free; Thixotropic for precise dispensing on ICs; Highly moisture resistant; Low dielectric constant for high frequency applications; Low modulus for minimal stress; Remains flexible at low temperatures

Applications:
Chip-on-glass; Chip-on-flex; Chip-on-board; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary heat cure; Blue fluorescing; Moisture and thermal resistance; Thixotropic for precise dispensing; Flexible

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components

Applications:
Potting; Tacking/Ruggedizing

Features:
Multi-Cure potting resin; Secondary heat cure; High tensile strength; UV/Visible light cure

Applications:
Potting; Recommended substrates include metal, glass, ceramic, and many thermoset plastics

Features:
Multi-Cure potting resin; Secondary heat cure; Activator cure; High tensile strength; UV/Visible light cure

Applications:
Potting; Tacking/Ruggedizing

Features:
Multi-Cure potting resin; Secondary heat cure; Activator cure; High tensile strength; UV/Visible light cure

Applications:
Reinforcing fine pitch or leadless components on printed circuit boards; Shock absorption; Underfill alternative

Features:
UV/Visible light cure; Halogen-free; Solvent free; Blue-to-clear upon exposure to UV/Visible light; Tack-free surface after cure; Compatible with needle or jet dispensing equipment; Very low VOCs; Adhesion to various PCB substrates; Reduces stress on board components; Highly thixotropic for minimal movement after dispense

Applications:
Conformal coating

Features:
UV/Visible light cure in seconds; Secondary moisture cure for shadowed areas; Halogen-free; Solvent free; One part, no mixing required; Bright blue fluorescing; Low viscosity for thin coatings; Chemically resistant; Low VOC; Low odor; MIL-I-46058C listed; IPC-CC-830B; UL 94 V-0; UL 746-E

Applications:
Conformal coating; Recommended substrates include lead frame, PCB, flex, silicone, and ceramic

Features:
UV/Visible light cure in seconds; Secondary moisture cure for shadowed areas; Excellent thermal shock resistance; Solvent free; One part, no mixing required; Bright blue fluorescing; Superior re-workability; Chemically resistant; Fast tack-free cure; Low surface tension; Halogen free

Applications:
Conformal coating

Features:
Halogen-free; Solvent free; Light cure in seconds; Secondary heat cure for shadow areas; Isocyanate free; One part, no mixing required; Low viscosity for thin coatings; Rigid for chemical and abrasion resistance; MIL-I-46058C listed; IPC-CC-830-B approved; UL recognized

Applications:
Fuel cells; Underwater enclosures; High-temperature sealing

Features:
UV/Visible light curing; Excellent water resistance; Excellent Acid/Base resistance; Self-leveling liquid; High/low temperature resistant; Cures in seconds; Silicone free; Nominal viscosity 60,000 cP

Applications:
Appliance housings; Critical electronic assemblies and devices; Electrical conduit boxes

Features:
UV/Visible light curing; Cures in seconds; Silicone free; Conforms to intricate channels or recesses; Excellent tear resistance; Cures soft and tack free; Low outgassing; Moisture-resistant sealing; 40,000 cP nominal viscosity