LED-Curable Gaskets For Handheld Power Tool Applications

Handheld Power Tools

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Product Description

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UV/Visible light-curable adhesive for rapid tacking of repair wires on PCBs. This product has high tensile strength, excellent adhesion, and faster UV fixture time. This adhesive features a secondary heat cure for complete cures in shadow areas.
Self-leveling flexible FIP/CIP gasket resin formulated for speaker assembly, sound damping, and automotive enclosures applications which require soft, tacky, flexible gasket with good deflection and self-leveling viscosity.
Flexible FIP/CIP gasketing resin for applications that require soft, tacky, flexible, low compression set. This silicone-free product cures upon exposure to UV/Visible light.
Soft, tacky, flexible FIP/CIP gasketing resin with good adhesion to plastic, metal, and ceramic surfaces. This product cures upon exposure to UV/Visible light and fluoresces blue for easy visual inspection.
FIP and CIP moisture and chemical resistant gasketing resin for fuel cells, underwater enclosures, and high-temperature sealing applications that require low compression set. This self-leveling product cures upon exposure to UV/Visible light.
501-E-REV-A Activator, when pre-applied to metallic, plated, ceramic, or glass substrates rapidly cures 600 series and 800 series structural adhesives and thermal interface materials in gaps from less than 1 mil to 20 mils.
High-performance structural bonding adhesive ideal for bonding dissimilar substrates where maximum tensile shear strength is required. This product cures using activator.
Fast-curing adhesive designed to form strong bonds to PMMA (Acrylic), polycarbonate, glass, and other plastic substrates. This product's clarity and low viscosity produce clear, bubble-free bond lines.
Optically clear structural adhesive for fast assembly of metal to glass, potting critical components, and large-area bonding. This high-impact product is resistant to yellowing and thermal shock.
Low viscosity conformal coating formulated with 100% solids for rapid room-temperature cure when exposed to UV light. This coating has a secondary heat-cure and ultra-high fluorescence.
Light and heat-curable encapsulant & potting resin for electronic assembly and circuit boards where enhanced moisture and thermal cycling, and abrasion resistance are required. This material provides optimal coverage over difficult circuit geometries and minimizes stress on delicate wire bonds.
Metal bonding adhesive curable with UV/Visible light, heat, or pre-applied activator. Visible light can penetrate through many UV-blocked and colored plastics and glasses. Applications include coil winding, potting, as well as metal-to-glass bonding.

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