Light-Curable Materials for Appliance Subcomponent Assembly

Appliance Subcomponent Assembly

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UV/Visible light-curable adhesive for rapid tacking of repair wires on PCBs. This product has high tensile strength, excellent adhesion, and faster UV fixture time. This adhesive features a secondary heat cure for complete cures in shadow areas.
Self-leveling flexible FIP/CIP gasket resin formulated for speaker assembly, sound damping, and automotive enclosures applications which require soft, tacky, flexible gasket with good deflection and self-leveling viscosity.
Flexible FIP/CIP gasketing resin for applications that require soft, tacky, flexible, low compression set. This silicone-free product cures upon exposure to UV/Visible light.
Soft, tacky, flexible FIP/CIP gasketing resin with good adhesion to plastic, metal, and ceramic surfaces. This product cures upon exposure to UV/Visible light and fluoresces blue for easy visual inspection.
High-strength resin for rigid adhesive bonds or potting of a wide variety of substrates. This resin cures clear and deep. This product can be cured with UV light, and shadow areas can be cured with heat.
FIP and CIP moisture and chemical resistant gasketing resin for fuel cells, underwater enclosures, and high-temperature sealing applications that require low compression set. This self-leveling product cures upon exposure to UV/Visible light.
501-E-REV-A Activator, when pre-applied to metallic, plated, ceramic, or glass substrates rapidly cures 600 series and 800 series structural adhesives and thermal interface materials in gaps from less than 1 mil to 20 mils.
High-performance structural bonding adhesive ideal for bonding dissimilar substrates where maximum tensile shear strength is required. This product cures using activator.
Fast-curing adhesive designed to form strong bonds to PMMA (Acrylic), polycarbonate, glass, and other plastic substrates. This product's clarity and low viscosity produce clear, bubble-free bond lines.
Rapidly bond and laminate flexible and rigid substrates including a variety of plastics. The bond strength of this product on PC and PVC usually exceeds the strength of the substrates being assembled.

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