Advanced Driver-Assistance Systems
Light-Cure Encapsulants and Positioning Adhesives for Reliable ADAS Sensors
Light-curable encapsulants and positioning adhesives protect sensors in Advanced Driver-Assistance Systems (ADAS) from harsh environments. Once considered high-end luxuries, ADAS are becoming standard features on most vehicles. These systems enhance driver safety by delivering notifications and warnings of impending dangers so that drivers may avoid them. Today’s vehicles use a mix of camera, radar/lidar, and ultrasonic sensor technology to make features like blind spot detection, cross traffic alerts, and parking assistance possible.
Dymax encapsulants cure in seconds upon exposure to UV/Visible light, cutting down on processing time and reducing work in progress. The materials are all one part, so no mixing is required and viscosity is consistent. They display very low movement with temperature variations and excellent resistance to humidity and thermal shock. Encapsulants with secondary heat cure for shadow areas are available, as well as UL-V0 (flammability) rated and fluorescing grades.
In addition, Dymax carries positioning adhesives for alignment of ADAS cameras and sensors.
Conformal coating; Chip encapsulation; Wire bonding
UV/Visible light cure; Secondary heat cure; Thixotropic; High viscosity coating
Chip-on-board; Chip-on-flex; Multi-chip modules; Chip-on-glass; Wire bonding; Bare die encapsulation
UV/Visible light cure for fastest processing; Halogen-free; LED light-curable; Secondary heat cure for shadowed areas; One part, no mixing is required; Solvent free, Isocyanate free; Low Tg, low modulus for wire bonding
Chip-on-glass; Chip-on-flex; Chip-on-board; Wire bonding
Halogen-free; UV/Visible light cure; Secondary heat cure; Blue fluorescing; Moisture and thermal resistance; Thixotropic for precise dispensing; Flexible
Advanced Driver Assistance Systems (ADAS); Camera Module Placement; Lidar; Active Alignment; Recommended substrates include LCP, PCB, PPS, and FPC
UV, heat, or UV/heat cure; Secondary heat cure for shadowed areas; Moisture and thermal cycle resistance; Exceptionally Low shrinkage; Solvent free; High Tg and low CTE; One part, no mixing required; Cold store/cold ship