Press Releases

Press Releases

Find the latest Dymax press releases to learn about global and local company initiatives.

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Introducing Multi-Cure® 9037-F Encapsulant for Printed Circuit Board Assembly

Dymax expands its range of encapsulant materials with the introduction of Multi-Cure 9037-F for a variety of glob-top, chip-on-board, chip-on-flex, chip-on-glass, and wire-tacking/bonding applications.

July 01, 2020
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