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Low Shrink Epoxy

9801

Low Shrinkage Camera Module Adhesive with LED and Heat-Cure Capability


Dymax 9801 is a LED or UV/Visible light-curable material with superior adhesion properties for bonding camera modules, lidar, active alignment applications. The adhesive is moisture and thermal cycle resistant and meets the stringent low-shrinkage requirements introduced for active alignment applications in Advanced Driver Assistance Systems (ADAS). 9801 cures with UV light but also features heat-cure capability for applications where shadowed areas exist. This one-component product bonds rapidly and is recommended for surfaces and substrates including LCP, PCB, PPS, FPC, CAP, PS, FR-4 board, and glass.

9801 requires cold storage/cold shipping and should be kept between 1°C [34°F] and 5°C [41°F] in the original, unopened container.

Dymax materials contain no nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.

This product is in full compliance with the RoHS2 Directives 2015/863/EU.

Low Shrinkage Camera Module Adhesive with LED and Heat-Cure Capability

Features

  • Fast cure with LED or UV/Visible light
  • Low temperature heat cure (80-85°C)
  • Moisture resistant
  • Thermal cycle resistant
  • Single component
  • Cold ship/Cold storage at 1-5°C
  • Passes ASTM E595 Outgassing Testing

Typical Properties

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Property Values
Viscosity (nominal) 60,000
Uncured appearance Off white, opaque gel
Volumetric shrinkage 1.5%
Recommended surfaces LCP; PCB; PPS; FPC
Recommended substrates CAP; PS; FR-4; Glass

Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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