Light-Curable BGA/CSP Reinforcement Adhesive
9309-SC adhesive cures upon exposure to UV/Visible light to quickly ruggedize circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary. The material provides rapid bonding to leadframe, PCB, silicon, and ceramic. The product is ideal for reinforcement of fine-pitch leads or leadless components as well as an alternative to underfill. This adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense.
9309-SC adhesive is formulated with See-Cure color-change technology, making it appear bright blue in the uncured state and very visible when dispensed onto substrates. The color changes from blue to colorless when exposed to sufficient light energy, providing visual confirmation of full cure.
Dymax materials are solvent free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. 9309-SC adhesive is in full compliance with the RoHS2 Directives 2015/863/EU.
|Dymax has a variety of halogen-free conformal coatings, adhesives, encapsulants, and potting materials.|
Viscosity (nominal): 45,000 cP
Uncured Appearance: Blue Transparent Gel
Substrates: Lead Frame; Ceramic; PCB; Silicon
- Reinforcing fine pitch or leadless components on printed circuit boards
- Shock absorption
- Underfill alternative
- UV/Visible light cure
- Solvent free
- Blue-to-clear upon exposure to UV/Visible light
- Tack-free surface after cure
- Compatible with needle or jet dispensing equipment
- Very low VOCs
- Adhesion to various PCB substrates
- Reduces stress on board components
- Highly thixotropic for minimal movement after dispense