Blue Fluorescing Encapsulant/Wire Bond Adhesive with Secondary Moisture Cure

Dual-cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Curing in seconds upon exposure to UV light energy, the product increases manufacturing efficiency because assembled parts can quickly move to the next step in production. This new formulation is also room-temperature stable, eliminating the need for cold shipping and storage.

For manufacturers involved with chip-on-board, chip-on-flex, chip-on-glass, and wire bonding assembly, this material features excellent flexibility and increased durability and resistance on boards. 9014 also provides good moisture and corrosion protection of critical components found in electronic applications such as electric vehicle battery management systems.

Dymax materials do not contain nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds allows for faster processing, greater output, and lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. This product is in full compliance with the RoHS Directives 2015/863/EU.


Viscosity (nominal):  12,500 cP

Uncured Appearance:  Light Yellow Translucent Gel

Linear Shrinkage, %:  1.8

Recommended Surfaces:  FR4; Kapton; Glass


  • Chip on Board
  • Chip on Flex
  • Chip on Glass
  • Wire Bonding


  • UV light cure
  • Secondary moisture cure capability
  • Flexible encapsulant
  • Shadowed area performance

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