215-CTH-T-UR-SC


Catheter Bonding Adhesive with Encompass® Technology

MD® 215-CTH-T-UR-SC catheter adhesive cures with light in seconds to quickly bond PEBA and Nylon 12, as well as other difficult to bond substrates. The product is ideal for next-generation catheter designs and is LED curable at 385 nm. For visual verification of cure and quality inspection, the adhesive features Encompass® technology that combines the color change benefits of Dymax See-Cure with Ultra-Red® fluorescing into one light-curable formulation. The blue color of See-Cure aids in verification of adhesive placement and transitions to colorless upon exposure to sufficient light energy, indicating full cure has been achieved. The bright red fluorescence of Ultra-Red technology contrasts extremely well on plastics that naturally fluoresce blue in color (like PVC), and also assists with post-cure visual inspection of the bond area.

Typical applications include assembly of manifold bond joints, balloon to lumen, and hub to lumen. 215-CTH-T-UR-SC catheter adhesive also meets a variety of ISO 10993 biocompatibility approvals.

Dymax MD® Medical Device Adhesives contain no nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. 215-CTH-T-UR-SC catheter adhesive is in full compliance with the RoHS2 Directives 2015/863/EU and 2011/65/EU.

Specifications


Viscosity:  6,000 cP (nominal)

Cured Properties:
Durometer Hardness: D55
Elongation at break: 300%

Recommended Substrates:
Nylon 12, PEBA, PC, ABS, TPU

Applications


  • Balloon/Lumen
  • Hub/Lumen
  • Manifold bond joints

Features


  • UV Optimized 385 nm
  • Blue to colorless upon cure
  • Ultra-Red® Fluorescing
  • Adhesion to a range of difficult to bond substrates

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