Light-Curable Materials for Automotive Camera Module Assembly

Automotive CMOS Assembly

Automotive Camera Module Assembly

Faster, Stronger Bonds for Camera Modules

Dymax light-curable adhesives are ideal for the assembly of camera modules found in automobiles and other vehicles. Our one-part solvent-free adhesives cure in seconds upon exposure to light, providing greater product yields in much shorter assembly times.  They provide excellent adhesion to substrates typically used in the manufacture of camera modules. The adhesives can withstand harsh conditions like moisture and shock, which automobiles are often exposed to, and also exhibit very low shrinkage.

Automotive Camera Module Assembly

Applications
Camera module to board bonding; Headlamp & fog light lamp lens to reflector housing; Polycarbonate headlamp assemblies

Features
UV/Visible light cure; Passed Ford WSB-M11P28-B; Passed GM 6432M

Applications:
CCM assembly; Plastics assembly; Household appliance assembly

Features:
Low-stress; Low shrinkage; Bonds LCP, PC, PU and PS; Cures in seconds upon exposure to high-intensity UV/Visible light

Applications:
CCM assembly; Plastic assembly; Household appliance assembly

Features:
Low shrinkage; Low-stress; Bonds LCP, PC, PU, and PS; Cures in seconds upon exposure to high-intensity UV/Visible light

Applications:
Metal-to-glass bonding; Coil winding; Potting

Features:
UV/Visible light cure; Secondary heat cure; Activator cure; Bonds multiple substrates; Hard and clear bonds

Applications:
Flex circuit bonding/attachment; Chip-on-flex; Chip-on-board

Features:
Halogen-free; UV/Visible light cure; One part, no mixing is required; Low VOC; Solvent free, Isocyanate free; Thixotropic for precise dispensing on ICs; Highly moisture resistant; Low dielectric constant for high frequency applications; Low modulus for minimal stress; Remains flexible at low temperatures

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components

Applications:
Reinforcing fine pitch or leadless components on printed circuit boards; Shock absorption; Underfill alternative

Features:
UV/Visible light cure; Halogen-free; Solvent free; Blue-to-clear upon exposure to UV/Visible light; Tack-free surface after cure; Compatible with needle or jet dispensing equipment; Very low VOCs; Adhesion to various PCB substrates; Reduces stress on board components; Highly thixotropic for minimal movement after dispense

Applications:
Advanced Driver Assistance Systems (ADAS); Camera Module Placement; Lidar; Active Alignment; Recommended substrates include LCP, PCB, PPS, and FPC

Features:
UV, heat, or UV/heat cure; Secondary heat cure for shadowed areas; Moisture and thermal cycle resistance; Exceptionally Low shrinkage; Solvent free; High Tg and low CTE; One part, no mixing required; Cold store/cold ship