Blue Fluorescing Encapsulant/Wire Bond Adhesive with Secondary Heat Cure

Multi-Cure® 9037-F is a resilient chip encapsulant designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This is often the case for conventional glob top encapsulation applications – for chip on board or chip on flex – as well as many wire bonding applications. 9037-F cures under broad-spectrum UV/Visible light, but also includes secondary heat cure to address applications where shadow areas are present. The encapsulant has great flexibility and provides high moisture as well as thermal resistance. It also fluoresces blue when exposed to black light, allowing for easy inspection.

Dymax materials are solvent free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. Multi-Cure® 9037-F is in full compliance with the RoHS2 Directives 2015/863/EU.


Viscosity (nominal):  55,000 cP

Cured Appearance:  Clear

Substrates:  Polyimide (Kapton®); Glass; FR4


  • Chip-on-glass
  • Chip-on-flex
  • Chip-on-board
  • Wire bonding


  • Halogen-free
  • UV/Visible light cure
  • Secondary heat cure
  • Blue fluorescing
  • Moisture and thermal resistance
  • Thixotropic for precise dispensing
  • Flexible

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