9001-E-v3.1


Multi-Cure® UV-Curable Encapsulant & Potting Resin

Dymax Multi-Cure® 9001-E-v3.1 encapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. The product provides optimal coverage over difficult circuit geometries. 9001-E-v3.1 encapsulating material has high ionic purity, is solvent free, and isocyanate free. This encapsulant has been engineered to have a low modulus and low Tg to minimize stress on delicate wire bonds. Material exposed to light will cure in seconds, while any shadowed areas will cure upon heat exposure. 9001-E-v3.1 Visible/UV light-curable encapsulant is formulated for fast on-demand cure with the Dymax BlueWave® UV light-curing systems.

9001-E-v3.1 encapsulant is especially well suited for chip-on-board, chip-on-flex, multi-chip modules, as well as wire bonding.

Dymax materials are solvent free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. Multi-Cure® 9001-E-v3.1 is in full compliance with the RoHS Directives 2002/95/EC and 2003/11EC.

Specifications


Viscosity (nominal):  4,500 cP

Cured Appearance:  Clear

Substrates:  Ceramic; Leadframe; PCB; Flex; Silicon

Package Sizes Available*:
10 mL Syringe (MR)
30 mL Syringe (MR)
160 mL Cartridge
300 mL Cartridge
550 mL Cartridge

*In Europe materials are sold in g/kg not mL/L

Applications


  • Chip-on-board
  • Chip-on-flex
  • Multi-chip modules
  • Chip-on-glass
  • Wire bonding
  • Bare die encapsulation

Features


  • UV/Visible light cure for fastest processing
  • Halogen-free
  • LED light-curable
  • Secondary heat cure for shadowed areas
  • One part, no mixing is required
  • Solvent free, Isocyanate free
  • Low Tg, low modulus for wire bonding

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