UV/Visible Light-Curable Materials for Thermal Interfaces
Rapidly Mount Heat-Sensitive Components onto Printed Circuit Boards
Multi-Cure® thermal interface materials provide an efficient method of thermal transfer between heat sinks and electronics. The products cure in seconds with light, heat, or activator, providing cutting edge performance characteristics with maximum processing convenience. Most applications utilize a combination of these curing methods for optimal cure speed. Light cure allows for exposed areas to cure immediately, fixturing parts in place so activator or heat can continue curing in shadowed areas without interruption to process flow.
Dymax thermally conductive adhesives are ideal for mounting heat sinks and heat-sensitive electronic components to printed circuit boards, eliminating the need for mechanical fasteners and clips. These products offer thermal conductivity levels as high as 0.9 W/m*K and are suited for applications where it is desirable to increase thermal conductivity between assembled parts.
Additional Benefits of TIMs:
- Remain in place prior to part being mated
- Instant fixture for immediate movement to next process
- Long-term reliability
- No heat exposure required
- Minimal expansion during thermal rise
- No refrigeration necessary
The high viscosity and highly thixotropic properties of these formulation make them ideal for dispensing and material placement.
|A variety of Dymax halogen-free conformal coatings, adhesives, encapsulants, and potting materials are also available.|
Cure with Dymax Multi-Cure® adhesives, suitable for gaps <0.001 to 0.020″ (preferred gap 0-0.002″); Used with Dymax 600 and 800 series structural bonding adhesives and thermal interface materials for increasing bond strength to metals, plated surfaces, ceramic, and glass substrates
Strong structural bonds; Fixtures in seconds; No solvent flash-off time; No VOCs and ODCs
Mounting heat sinks; Bonding heat sensitive components to PCBs
Halogen-free; Highly conductive; Fast UV light cure for immediate fixture strength; Secondary activator or heat cure; Thixotropic for easy dispense and placement prior to cure; Superior adhesion to FR4 and many metals