Light/Moisture-Cure Flexible Encapsulant

9103 dual-cure encapsulant is a resilient light/moisture-cure chip-encapsulating material. 9103 cures first upon exposure to UV/Visible light, then with ambient moisture over time for areas on PCBs where shadow areas are present. Bondable substrates include FR4, glass, and also Kapton®. Typical encapsulating applications include chip-on board, flex, and glass, as well as wire bonding.

Dymax materials are solvent free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. 9103 is in full compliance with the RoHS2 Directives 2015/863/EU.


Viscosity (nominal):  25,000 cP

Cured Appearance:  Clear

Substrates:  FR4; Kapton; Glass


  • Chip-on-board
  • Chip-on-flex
  • Chip-on-glass
  • Wire bonding


  • Halogen-free
  • UV/Visible light cure
  • Secondary moisture cure
  • Flexible encapsulant
  • Low VOC
  • Solvent free, Isocyanate free
  • Shadowed area performance
  • Moisture and thermal resistance
  • High CTE/low Tg for lower stress on components

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