Ultra Light-Weld® UV-Curable Flex Circuit Adhesive & Encapsulant

Ultra Light-Weld® 9008 engineered for chip encapsulation on flex circuits cures upon exposure to UV and/or visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. Dymax 9008 encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces such as polyimide (Kapton®), DAP, glass, epoxy board, metal, and PET. 9008 remains flexible to -40°C, making it ideal for COF applications. It is engineered for chip encapsulation on flex circuits. This product is thixotropic, allowing for easy formation of a protective encapsulant layer. It has a low dielectric constant for high frequency applications. This encapsulating material may be used in attaching FPCs to various substrates including PCB and glass.

Dymax materials are solvent free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. This product is in full compliance with the RoHS2 Directives 2015/863/EU.


Viscosity (nominal):  4,500 cP

Cured Appearance:  Clear

Substrates:  Polyimide (Kapton®); DAP; Glass; Epoxy Board; Metal

Applications & Features

  • Flex circuit bonding/attachment
  • Chip-on-flex
  • Chip-on-board


  • Halogen-free
  • UV/Visible light cure
  • One part, no mixing is required
  • Low VOC
  • Solvent free, Isocyanate free
  • Thixotropic for precise dispensing on ICs
  • Highly moisture resistant
  • Low dielectric constant for high frequency applications
  • Low modulus for minimal stress
  • Remains flexible at low temperatures

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