Halogen-Free Adhesives, Coatings, and Materials
When ignited, bromine and chlorine are known to emit toxic and corrosive gases. In 2003, standards created by the International Electromechanical Commission (IEC) were passed into law to eliminate concerns associated with end of life/disposal of devices containing these chemicals. Initial target areas include consumer electronics as well as household appliances.
The Dymax Documented Halogen-Free Program
Dymax adhesives, conformal coatings, encapsulants, and potting compounds are documented by an independent laboratory to meet or exceed standards set forth in IEC 61249-2-21.
This international directive defines halogen-free as <900 ppm for chlorine, <900 ppm for bromine and < 1500 ppm total level of both combined. The current test method used for certification is BS EN 14582:2007.
Dymax halogen-free formulations have been the global standard for many years. We offer a wide variety of materials that meet industry mandates without sacrificing performance requirements.
Declared Halogen-Free Materials
|Product||Viscosity (nominal)||Primary Features||Link to Halogen-Free Report|
|9481-E||125 cP||Room temperature secondary moisture cure, enhanced chemical resistance||Get Report|
|9-20351-UR||13,500 cP||High viscosity for selective application of thick coating optimized for wetting high-profile leads, Ultra-Red® fluorescing, as well as secondary heat cure for shadowed areas||Get Report|
|9-20557||2,700 cP||Medium viscosity for coverage and high thermal shock performance||Get Report|
|9-20557-LV||800 cP||Low viscosity version of 9-20557 for spray equipment compatibility||Get Report|
|984-LVUF||125 cP||Rigid, low viscosity coating, high chemical resistance||Get Report|
|987||150 cP||Thin, chemically resistant conformal coating, recommended for difficult-to-wet components and assembly materials||Get Report|
|921-GEL||25,000 cP||Light cure potting resin, secondary heat cure, one part, no mixing is required, multiple viscosities, visible light cure for maximum cure depth, adhesion to filled plastics including PBT/Valox®||Get Report|
|921-T||3,500 cP||Light cure potting resin, secondary heat cure, one part, no mixing is required, multiple viscosities, visible light cure for maximum cure depth, adhesion to filled plastics including PBT/Valox®||Get Report|
|921-VT||11,000 cP||Light cure potting resin, secondary heat cure, one part, no mixing is required, multiple viscosities, visible light cure for maximum cure depth, adhesion to filled plastics including PBT/Valox®||Get Report|
|9001-E-v3.1||4,500 cP||Multi-purpose adhesive, potting material & encapsulant||Get Report|
|9008||4,500 cP||Flex circuit adhesive and encapsulant, thixotropic for precise dispensing on ICs, highly moisture resistant, low dielectric constant for high frequency applications, low modulus for minimal stress, remains flexible at low temperatures||Get Report|
|9422-SC||38,000 cP||Light cure BGA, component/CSP reinforcement adhesive, See-Cure, highly thixotropic, BGA/VGA ruggedizing||Get Report|
|9663||600 cP||Light-cure keypad coating, low viscosity minimizes air entrapment, low outgassing, one part – no mixing required, high flexibility, resistant to yellowing, abrasion resistant||Get Report|
|9-318-F||50,000 cP||Peelable maskant for electronics, highly thixotropic for manual or automated dispensing on difficult-to-mask areas, fluoresces for visual inspection, medium adhesion for easy removal||Get Report|
|9-911-REV-A||40,000 cP||Wire tacking and coil termination adhesive for electronics, low shrinkage, one part – no mixing is required, does not contain silicone||Get Report|
|9-20479-B||150,000 cP||Peelable maskant for electronics, highly thixotropic for manual or automated dispensing, blue color for visual inspection, medium adhesion for easy peeling||Get Report|
|9-20737||10,000 cP||Display sealing adhesive, highly thixotropic for optimal product placement, one part – no mixing required, compatible with Dymax optical bonding adhesives, enhanced resistance to yellowing from heat or UV exposure||Get Report|
|9-20801||110,000 cP||Thermal interface adhesive, thermally conductive, 0.9 W/m*K, light cure in seconds, secondary heat cure, highly thixotropic for optimal placement, visible light cure for maximum cure depth
*Coefficient of thermal conductivity