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MD® Medical Device Adhesive

1405M-T-UR-SC

LED Optimized Adhesive with Encompass® Technology for Plastics and Metals


LED curable at  405 nm wavelength light, MD® 1405M-T-UR-SC needle bonding adhesive bonds substrates typically used in medical device manufacturing as well as needle assembly. This solvent-free product provides deeper section cures for fast bonding of a variety of metals and plastics.

MD® 1405M-T-UR-SC needle bonding adhesive features Encompass® technology which combines Dymax patented See-Cure color change and Ultra-Red® fluorescing technologies into one light-curable formulation. The bright blue color of See-Cure technology enables visual confirmation of material placement onto components and verification of complete cure. Ultra-Red provides bright red fluorescence under low-intensity black light (365 nm) for post-cure quality inspection.

Bondable substrates include stainless steel, PC, ABS, and also PMMA. The product meets ISO 10993-5 biocompatibility approval and is ideal for bonding winged infusion sets, blood transfer devices, collection sets, as well as needle/syringe bonding, safety sharps devices.

Dymax MD® Medical Device adhesives are solvent-free and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax light-curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for medical device assembly. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.

MD® 1405M-T-UR-SC needle bonding adhesive is in full compliance with the RoHS2 Directives 2015/863/EC.

Features

  • LED optimized for 405 nm
  • Formulated with Encompass® technology (combines See Cure & Ultra-Red)
  • See Cure - dispenses blue, cures clear
  • Ultra-Red® - fluoresces bright red
  • Higher viscosity
  • Deeper section cure
  • Compliant with ISO 10993

Typical Properties

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Property Values
Viscosity (nominal) 7,000 cP
Cured durometer hardness D70
Cured elongation at break 180%
Recommended Substrates Stainless Steel; PC; PS; ABS; PMMA

Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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