Low Outgassing Adhesive for CMOS Assembly

Ultra Light-Weld® 3-20686 adhesive cures in seconds upon exposure to light energy for rapid assembly of camera modules as well as polycarbonate components. Curing is usually completed in as little as two seconds upon exposure to longwave UV and visible light. This material is ideal for active alignment (camera module holder to PC board bonding). Recommended substrates include PC, LCP, PCB, FPC, ceramic, and also metalized plastics.

Dymax Ultra Light-Weld® materials contain no nonreactive solvents. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. Ultra Light-Weld® 3-20686 is in full compliance with the RoHS2 Directives 2015/863/EU.


Viscosity (nominal):  4000 cP

Cured Appearance:  Clear

Substrates:  PC; LCP; PCB; FPC; Ceramic; Metalized Plastics


  • Camera module to board bonding
  • Headlamp & fog light lamp lens to reflector housing
  • Polycarbonate headlamp assemblies


  • UV/Visible light cure
  • Passed Ford WSB-M11P28-B
  • Passed GM 6432M

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