Appliance Subcomponent Assembly

Product Number

Product Description

Regional Availability

501-E-REV-A
501-E-REV-A Activator, when pre-applied to metallic, plated, ceramic, or glass substrates rapidly cures 600 series and 800 series structural adhesives and thermal interface materials in gaps from less than 1 mil to 20 mils.
GA-142
Flexible FIP/CIP gasketing resin for applications that require soft, tacky, flexible, low compression set. This silicone-free product cures upon exposure to UV/Visible light.
921-T
High-strength resin for rigid adhesive bonds or potting of a wide variety of substrates. This resin cures clear and deep. This product can be cured with UV light, and shadow areas can be cured with heat.
3099
Fast-curing adhesive designed to form strong bonds to PMMA (Acrylic), polycarbonate, glass, and other plastic substrates. This product's clarity and low viscosity produce clear, bubble-free bond lines.
3069
Rapidly bond and laminate flexible and rigid substrates including a variety of plastics. The bond strength of this product on PC and PVC usually exceeds the strength of the substrates being assembled.
846-GEL
High-performance structural bonding adhesive ideal for bonding dissimilar substrates where maximum tensile shear strength is required. This product cures using activator.
GA-103
Form-in-place gasket sealant has excellent moisture- and chemical resistance for high-temperature sealing applications and underwater enclosures that require a low compression set. This silicone-free gasket has a self-leveling viscosity and cures with UV/Visible light in seconds.
GA-120
Self-leveling FIP gasket with good deflection is formulated for applications such as speaker assembly and automotive enclosures, which require a soft, tacky, flexible gasket.
GA-142-F
Soft, tacky, flexible FIP/CIP gasketing resin with good adhesion to plastic, metal, and ceramic surfaces. This product cures upon exposure to UV/Visible light and fluoresces blue for easy visual inspection.
9-911-REV-B
UV/Visible light-curable adhesive for rapid tacking of repair wires on PCBs. This product has high tensile strength, excellent adhesion, and faster UV fixture time. This adhesive features a secondary heat cure for complete cures in shadow areas.

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