Potting Compound Materials for Electronics Assembly

灌封料

用于电子装置和工业应用的紫外灌封化合物

为电子元件和电路提供良好的保护

Dymax光固化紫外光封装材料可以在紫外线/可见光下数秒内达到表干。针对不同的基材,我们有专用的灌封材料,能够牢固地粘合塑料和金属。Dymax LED 保护密封剂和灌封材料也可用于提高 LED 性能。

紫外光封装树脂能减少混合比例错误所产生的浪费,且该类产品不含异氰酸脂和重金属。此类材料操作过程只需几秒钟,无需工装、夹具、机架、烘箱等设备,从而节省空间,降低总库存成本。紫外光灌封材料是连接器、感应器、探测器、电容、射频电路、继电器螺丝、传感器、防篡改和 PCB 密封的浅表元件灌封和密封的理想选择。

Applications:
Chip-on-board
Chip-on-flex
Multi-chip modules
Chip-on-glass
Wire bonding
Bare die encapsulation

Features:
UV/Visible light cure for fastest processing
Halogen-free
LED light-curable
Secondary heat cure for shadowed areas
One part, no mixing is required
Solvent free, Isocyanate free
Low Tg, low modulus for wire bonding

 

Applications:
Potting
Tacking/Ruggedizing

Features:
Multi-Cure potting resin
Secondary heat cure
High tensile strength
UV/Visible light cure

 

Applications:
Potting
Recommended substrates include metal, glass, ceramic, and many thermoset plastics

Features:
Multi-Cure potting resin
Secondary heat cure
Activator cure
High tensile strength
UV/Visible light cure

 

Applications:
Potting
Tacking/Ruggedizing

Features:
Multi-Cure potting resin
Secondary heat cure
Activator cure
High tensile strength
UV/Visible light cure