Light-curable encapsulants protect sensitive components on printed circuit boards, including bare die, wire bonds, and ICs.

用于微电子保护的密封剂

微电子装配和IC保护的电子元件包封胶

坚固柔韧的包封胶,适用于裸芯片、焊线或集成电路 (IC)

Dymax Ultra Light-Weld ®电子元件包封胶在紫外线或可见光的照射下变得坚固柔韧,可很好的应用于裸芯片、焊线及集成电路(IC)。产品能快速固化能减少加工、能耗成本,是具有参考价值的替代方案。这些材料为单组分材料,无需混合。 Dymax电子元件包封胶有极低的离子含量,防湿气及高温冲击,可很好地保护电器元件。此外,它们不含锋利粗糙的矿物质及玻璃填充料,所以不会磨损细的金属线。低玻璃化温度及低模组系数,低应力。

紫外线固化树脂用于弧面滴胶和COB工艺。它们可用在FPC上包封集成电路,保护电路或将其粘合在玻璃及PCB上。产品粘度范围很广,从极易流动胶水到不流动的凝胶供您选择。Dymax LED保护包封胶也可提高LED的性能。

Applications:
Conformal coating
Chip encapsulation
Wire bonding

Features:
UV/Visible light cure
Secondary heat cure
Thixotropic
High viscosity coating

 

Applications:
Chip-on-board
Chip-on-flex
Multi-chip modules
Chip-on-glass
Wire bonding
Bare die encapsulation

Features:
UV/Visible light cure for fastest processing
Halogen-free
LED light-curable
Secondary heat cure for shadowed areas
One part, no mixing is required
Solvent free, Isocyanate free
Low Tg, low modulus for wire bonding

 

Applications:
Flex circuit bonding/attachment
Chip-on-flex
Chip-on-board

Features:
Halogen-free
UV/Visible light cure
One part, no mixing is required
Low VOC
Solvent free, Isocyanate free
Thixotropic for precise dispensing on ICs
Highly moisture resistant
Low dielectric constant for high frequency applications
Low modulus for minimal stress
Remains flexible at low temperatures

 

Applications:
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding
Recommended surfaces include FR4, Kapton, Glass

Features:
UV light cure
Secondary moisture cure capability
Flelxible encapsulant
Shadowed area performance

 

Applications:
Chip-on-glass
Chip-on-flex
Chip-on-board
Wire bonding

Features:
Halogen-free
UV/Visible light cure
Secondary heat cure
Blue fluorescing
Moisture and thermal resistance
Thixotropic for precise dispensing
Flexible

 

Applications:
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding

Features:
Halogen-free
UV/Visible light cure
Secondary moisture cure
Flexible encapsulant
Low VOC
Solvent free, Isocyanate free
Shadowed area performance
Moisture and thermal resistance
High CTE/low Tg for lower stress on components

 

Applications:
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding

Features:
Halogen-free
UV/Visible light cure
Secondary moisture cure
Flexible encapsulant
Low VOC
Solvent free, Isocyanate free
Shadowed area performance
Moisture and thermal resistance
High CTE/low Tg for lower stress on components

 

Applications:
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding

Features:
Halogen-free
UV/Visible light cure
Secondary moisture cure
Flexible encapsulant
Low VOC
Solvent free, Isocyanate free
Shadowed area performance
Moisture and thermal resistance
High CTE/low Tg for lower stress on components