Light-curable encapsulants protect sensitive components on printed circuit boards, including bare die, wire bonds, and ICs.

用于微电子保护的密封剂

微电子装配和IC保护的电子元件包封胶

坚固柔韧的包封胶,适用于裸芯片、焊线或集成电路 (IC)

Dymax Ultra Light-Weld ®电子元件包封胶在紫外线或可见光的照射下变得坚固柔韧,可很好的应用于裸芯片、焊线及集成电路(IC)。产品能快速固化能减少加工、能耗成本,是具有参考价值的替代方案。这些材料为单组分材料,无需混合。 Dymax电子元件包封胶有极低的离子含量,防湿气及高温冲击,可很好地保护电器元件。此外,它们不含锋利粗糙的矿物质及玻璃填充料,所以不会磨损细的金属线。低玻璃化温度及低模组系数,低应力。

紫外线固化树脂用于弧面滴胶和COB工艺。它们可用在FPC上包封集成电路,保护电路或将其粘合在玻璃及PCB上。产品粘度范围很广,从极易流动胶水到不流动的凝胶供您选择。Dymax LED保护包封胶也可提高LED的性能。

微电子组装和集成电路保护密封剂

Applications:
Conformal coating; Chip encapsulation; Wire bonding

Features:
UV/Visible light cure; Secondary heat cure; Thixotropic; High viscosity coating

Applications:
Chip-on-board; Chip-on-flex; Multi-chip modules; Chip-on-glass; Wire bonding; Bare die encapsulation

Features:
UV/Visible light cure for fastest processing; Halogen-free; LED light-curable; Secondary heat cure for shadowed areas; One part, no mixing is required; Solvent free, Isocyanate free; Low Tg, low modulus for wire bonding

Applications:
Flex circuit bonding/attachment; Chip-on-flex; Chip-on-board

Features:
Halogen-free; UV/Visible light cure; One part, no mixing is required; Low VOC; Solvent free, Isocyanate free; Thixotropic for precise dispensing on ICs; Highly moisture resistant; Low dielectric constant for high frequency applications; Low modulus for minimal stress; Remains flexible at low temperatures

Applications:
Chip-on-glass; Chip-on-flex; Chip-on-board; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary heat cure; Blue fluorescing; Moisture and thermal resistance; Thixotropic for precise dispensing; Flexible

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components