Light-curable encapsulants protect sensitive components on printed circuit boards, including bare die, wire bonds, and ICs.

Encapsulation Materials

Encapsulants For Printed Circuit Board Components

Protection for Bare Die, Wire Bonds, Chip-On-Board & Integrated Circuits (ICs)

9000-series encapsulants cure tack free in seconds upon exposure to UV/Visible light for superior protection on both flexible and rigid PCB platforms. Dual-cure grades also feature secondary ambient moisture cure for shadow areas. These fast-curing materials help reduce processing and energy costs associated with alternative technologies and are easily incorporated into automated systems for maximizing microelectronic assembly and production speeds.

Tough and flexible, the products exhibit high ionic purity as well as resistance to humidity and thermal shock to effectively protect components and improve their reliability. They contain no sharp, abrasive, mineral or glass fillers to abrade fine wires, and their combination of low Tg and low modulus results in low stress wire bonding.

Electronic Encapsulation Applications Include:

  • Chip-On-Board, Flex, and Glass
  • Bare Die Encapsulating
  • IC to Flex Circuit Attachment and Bonding
  • Glob Top Encapsulation
  • Circuit Coating
  • Wire Bonding

Dymax encapsulant adhesives are all one part, so no mixing is required and viscosity is consistent. They have excellent adhesion to polyimide, PET, flexible printed circuits, FR4, as well as ceramic boards. Formulations are available in a wide range of viscosities, from thin to non-flowing gel.

Additional Benefits of 9000-Series Encapsulants:

  • Fast cure increases throughput and minimizes handling
  • Secondary moisture cure ensures fast cure rate for shadow areas
  • 100% solvent-free chemistry means high coverage and very low VOCs
  • Low stress under thermal cycling, as well as being electrically insulating, equals maximum post-assembly reliability
  • Simple dispense eliminates costs associated with complex dispensing system maintenance
Halogen-Free Dymax Products A variety of Dymax halogen-free conformal coatings, adhesives, and potting materials are also available.

Applications:
Conformal coating
Chip encapsulation
Wire bonding

Features:
UV/Visible light cure
Secondary heat cure
Thixotropic
High viscosity coating

 

Applications:
Chip-on-board
Chip-on-flex
Multi-chip modules
Chip-on-glass
Wire bonding
Bare die encapsulation

Features:
UV/Visible light cure for fastest processing
Halogen-free
LED light-curable
Secondary heat cure for shadowed areas
One part, no mixing is required
Solvent free, Isocyanate free
Low Tg, low modulus for wire bonding

 

Applications:
Flex circuit bonding/attachment
Chip-on-flex
Chip-on-board

Features:
Halogen-free
UV/Visible light cure
One part, no mixing is required
Low VOC
Solvent free, Isocyanate free
Thixotropic for precise dispensing on ICs
Highly moisture resistant
Low dielectric constant for high frequency applications
Low modulus for minimal stress
Remains flexible at low temperatures

 

Applications:
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding
Recommended surfaces include FR4, Kapton, Glass

Features:
UV light cure
Secondary moisture cure capability
Flelxible encapsulant
Shadowed area performance

 

Applications:
Chip-on-glass
Chip-on-flex
Chip-on-board
Wire bonding

Features:
Halogen-free
UV/Visible light cure
Secondary heat cure
Blue fluorescing
Moisture and thermal resistance
Thixotropic for precise dispensing
Flexible

 

Applications:
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding

Features:
Halogen-free
UV/Visible light cure
Secondary moisture cure
Flexible encapsulant
Low VOC
Solvent free, Isocyanate free
Shadowed area performance
Moisture and thermal resistance
High CTE/low Tg for lower stress on components

 

Applications:
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding

Features:
Halogen-free
UV/Visible light cure
Secondary moisture cure
Flexible encapsulant
Low VOC
Solvent free, Isocyanate free
Shadowed area performance
Moisture and thermal resistance
High CTE/low Tg for lower stress on components

 

Applications:
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding

Features:
Halogen-free
UV/Visible light cure
Secondary moisture cure
Flexible encapsulant
Low VOC
Solvent free, Isocyanate free
Shadowed area performance
Moisture and thermal resistance
High CTE/low Tg for lower stress on components