Encapsulants for Microelectronic Assembly & IC Protection

Encapsulants

Encapsulants for Microelectronic Assembly and IC Protection

UV/Visible Light Curing Protection for Bare Die, Wire Bonds & Integrated Circuits

Encapsulants cure in seconds upon exposure to UV/Visible light for protection of bare die, wire bonds, and integrated circuits (IC). These fast-curing materials help reduce processing and energy costs associated with alternative technologies. The products are all one part, so no mixing is required and viscosity is consistent. Multi-Cure® and Ultra Light-Weld® encapsulating materials have high ionic purity and resistance to humidity and thermal shock, which effectively protect components. These materials contain no sharp, abrasive mineral or glass fillers which may abrade fin wires. Their combination of low Tg and low modulus translates into low stress for bonded wires.

Light-curable electronic encapsulation materials are ideal for wire bonding, glob top, and chip-on-board applications. They may also be used on flex circuits (FPC) for encapsulating ICs, coating the circuit, or attaching it to glass or printed circuit board. The products come in a wide range of viscosities, from thin wicking to non-flowing gel. For applications where shadow areas are present, Dymax offers dual-cure UV/Visible light and secondary ambient moisture-cure formulations .

Halogen-Free Dymax Products Dymax has halogen-free formulations. We offer a wide variety of halogen-free conformal coatings, adhesives, encapsulants, and potting materials.
Encapsulants for Electronics Assembly

Applications:
Conformal coating; Chip encapsulation; Wire bonding

Features:
UV/Visible light cure; Secondary heat cure; Thixotropic; High viscosity coating

Applications:
Chip-on-board; Chip-on-flex; Multi-chip modules; Chip-on-glass; Wire bonding; Bare die encapsulation

Features:
UV/Visible light cure for fastest processing; Halogen-free; LED light-curable; Secondary heat cure for shadowed areas; One part, no mixing is required; Solvent free, Isocyanate free; Low Tg, low modulus for wire bonding

Applications:
Flex circuit bonding/attachment; Chip-on-flex; Chip-on-board

Features:
Halogen-free; UV/Visible light cure; One part, no mixing is required; Low VOC; Solvent free, Isocyanate free; Thixotropic for precise dispensing on ICs; Highly moisture resistant; Low dielectric constant for high frequency applications; Low modulus for minimal stress; Remains flexible at low temperatures

Applications:
Chip-on-glass; Chip-on-flex; Chip-on-board; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary heat cure; Blue fluorescing; Moisture and thermal resistance; Thixotropic for precise dispensing; Flexible

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components