Light-curable encapsulants protect sensitive components on printed circuit boards, including bare die, wire bonds, and ICs.

Encapsulation Materials

Encapsulants For Printed Circuit Board Components

Protection for Bare Die, Wire Bonds, Chip-On-Board & Integrated Circuits (ICs)

9000-series encapsulants cure tack free in seconds upon exposure to UV/Visible light for superior protection on both flexible and rigid PCB platforms. Dual-cure grades also feature secondary ambient moisture cure for shadow areas. These fast-curing materials help reduce processing and energy costs associated with alternative technologies and are easily incorporated into automated systems for maximizing microelectronic assembly and production speeds.

Tough and flexible, the products exhibit high ionic purity as well as resistance to humidity and thermal shock to effectively protect components and improve their reliability. They contain no sharp, abrasive, mineral or glass fillers to abrade fine wires, and their combination of low Tg and low modulus results in low stress wire bonding.

Encapsulation Applications Include:

  • Chip-On-Board, Flex, and Glass
  • Bare Die Encapsulating
  • IC to Flex Circuit Attachment and Bonding
  • Glob Top Encapsulation
  • Circuit Coating
  • Wire Bonding

The encapsulants are all one part, so no mixing is required and viscosity is consistent. They have excellent adhesion to polyimide, PET, flexible printed circuits, FR4, as well as ceramic boards. Formulations are available in a wide range of viscosities, from thin to non-flowing gel.

Additional Benefits of 9000-Series Encapsulants:

  • Fast cure increases throughput and minimizes handling
  • Secondary moisture cure ensures fast cure rate for shadow areas
  • 100% solvent-free chemistry means high coverage and very low VOCs
  • Low stress under thermal cycling as well as being electrically insulating equals maximum post-assembly reliability
  • Simple dispense eliminates costs associated with complex dispensing system maintenance
Halogen-Free Dymax Products A variety of Dymax halogen-free conformal coatings, adhesives, and potting materials are also available.
Encapsulants for Electronics Assembly

Applications:
Conformal coating; Chip encapsulation; Wire bonding

Features:
UV/Visible light cure; Secondary heat cure; Thixotropic; High viscosity coating

Applications:
Chip-on-board; Chip-on-flex; Multi-chip modules; Chip-on-glass; Wire bonding; Bare die encapsulation

Features:
UV/Visible light cure for fastest processing; Halogen-free; LED light-curable; Secondary heat cure for shadowed areas; One part, no mixing is required; Solvent free, Isocyanate free; Low Tg, low modulus for wire bonding

Applications:
Flex circuit bonding/attachment; Chip-on-flex; Chip-on-board

Features:
Halogen-free; UV/Visible light cure; One part, no mixing is required; Low VOC; Solvent free, Isocyanate free; Thixotropic for precise dispensing on ICs; Highly moisture resistant; Low dielectric constant for high frequency applications; Low modulus for minimal stress; Remains flexible at low temperatures

Applications:
Chip-on-glass; Chip-on-flex; Chip-on-board; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary heat cure; Blue fluorescing; Moisture and thermal resistance; Thixotropic for precise dispensing; Flexible

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components

Applications:
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding

Features:
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components