Light-Curable Camera Module Adhesives
Faster, Stronger Bonds for Consumer Electronics
Camera module adhesives and light-curable materials are utilized for the assembly of camera modules found in smart connected devices and automobiles, as well as security and industrial camera systems. The materials cure in seconds upon exposure to light energy, providing greater product yields in a much shorter assembly time.
The products have excellent adhesion to a variety of plastics as well as metals used in the manufacturing of consumer electronics, including camera modules and electronic device housings. They are capable of withstanding harsh conditions like moisture, heat and shock, which electronic devices are often exposed to.
Bondable substrates include glass, Kapton, PMMA, ceramic, silicon, leadframe, flex circuit, and even FR4, ABS, and LCP. LCMs are available for a variety of applications including active alignment, positioning/barrel fixturing, as well as FPC reinforcement.
Camera Module Adhesive Applications:
1 – Bonding the camera lenses
2 – Fixturing the lens barrel to lens holder
3 – Bonding the lens holders to the PCB (Active Alignment)
4 – Flexible PCB Reinforcement
5 – Bonding the IR filter to the lens holder
6 – Attaching the CCD or CMOS die to the PCB
Formulations with bend resistance, good surface dry, low outgassing, low shrinkage, as well as good electrical properties and flexibility are available.
Camera module to board bonding; Headlamp & fog light lamp lens to reflector housing; Polycarbonate headlamp assemblies
UV/Visible light cure; Passed Ford WSB-M11P28-B; Passed GM 6432M
CCM assembly; Plastics assembly; Household appliance assembly
Low-stress; Low shrinkage; Bonds LCP, PC, PU and PS; Cures in seconds upon exposure to high-intensity UV/Visible light
CCM assembly; Plastic assembly; Household appliance assembly
Low shrinkage; Low-stress; Bonds LCP, PC, PU, and PS; Cures in seconds upon exposure to high-intensity UV/Visible light
Metal-to-glass bonding; Coil winding; Potting
UV/Visible light cure; Secondary heat cure; Activator cure; Bonds multiple substrates; Hard and clear bonds
Flex circuit bonding/attachment; Chip-on-flex; Chip-on-board
Halogen-free; UV/Visible light cure; One part, no mixing is required; Low VOC; Solvent free, Isocyanate free; Thixotropic for precise dispensing on ICs; Highly moisture resistant; Low dielectric constant for high frequency applications; Low modulus for minimal stress; Remains flexible at low temperatures
Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding
Halogen-free; UV/Visible light cure; Secondary moisture cure; Flexible encapsulant; Low VOC; Solvent free, Isocyanate free; Shadowed area performance; Moisture and thermal resistance; High CTE/low Tg for lower stress on components
Reinforcing fine pitch or leadless components on printed circuit boards; Shock absorption; Underfill alternative
UV/Visible light cure; Halogen-free; Solvent free; Blue-to-clear upon exposure to UV/Visible light; Tack-free surface after cure; Compatible with needle or jet dispensing equipment; Very low VOCs; Adhesion to various PCB substrates; Reduces stress on board components; Highly thixotropic for minimal movement after dispense
Advanced Driver Assistance Systems (ADAS); Camera Module Placement; Lidar; Active Alignment; Recommended substrates include LCP, PCB, PPS, and FPC
UV, heat, or UV/heat cure; Secondary heat cure for shadowed areas; Moisture and thermal cycle resistance; Exceptionally Low shrinkage; Solvent free; High Tg and low CTE; One part, no mixing required; Cold store/cold ship