Light-curable electronic adhesives and materials for protection of components in electronics applications.

Electronics Assembly

Light-Curable Electronic Adhesives and Materials

Protect Electronic Circuitry and Components From Environmental Damage

One-part, solvent-free electronic adhesives and materials cure in seconds upon exposure to UV/Visible light energy. A wide variety of light-curable products are available for circuit protection and electronic component assembly applications. Many are electrically insulating and designed for various operations including conformal coating, encapsulation, ruggedizing and reinforcement, thermal management, as well as optical display bonding and lamination. Most materials have multiple-viscosity grades so manufacturers can tailor the material flow to the specific project requirements. The products are used in automotive and consumer electronics and aerospace and defense applications.

Light-Curable Materials Include:

  • Camera Module LCMs:  Adhesives for smart connected devices and automobiles, as well as security and industrial camera systems, cure in seconds, providing greater product yields in a much shorter assembly time. They form excellent adhesion to a variety of plastic and metal substrates typically used in the manufacturing of electronic device housings and camera modules and can withstand harsh conditions like moisture, heat, as well as shock.
  • Conformal Coatings: Users can apply the coatings over the entire printed circuit board surface or in discreet areas to provide complete protection from harsh environments or chemical exposure. Many products come in IPC approved, MIL-I-46058C, and UL listed self-extinguishing grades. Multiple shadow-area cure options, including dual-cure and light/moisture cure formulations, are also available.
  • Encapsulants: Protect components on rigid or flexible boards to -40°C. Encapsulating materials are ideal for microelectronic assembly and IC protection.
  • Halogen-Free Materials: A variety of adhesives, coatings, encapsulants, and potting compounds are available that meet halogen-free industry mandates without sacrificing performance requirements.
  • LED Protection Materials: Light Cap® LED encapsulants and led potting materials cure in seconds to provide optimal protection of LEDs. They are capable of enduring higher operating temperatures, resist yellowing, and also transmit more light than competing technologies.
  • Optical Display & Lamination Adhesives: Fast, on-demand cure allows substrates to be re-positioned precisely until parts are ready to be cured. These adhesives are for applications where durable, crystal-clear, as well as invisible bonds are required.
  • Peelable Maskants: One part, solvent- and silicone-free Ultra Light-Weld® peelable electronic maskants are ideal for conformal coating, wave soldering, and reflow operations.
  • Potting Compounds: These one-part materials can achieve full, tack-free cure in seconds and dramatically reduce cycle times and costs. They also offer tenacious adhesion to plastics as well as metals.
  • Thermal Interface Materials: TIMs cure in seconds with light, heat, or activator to effectively transfer heat to keep components cool.
  • Wire Tacking Adhesives: Ruggedizing and staking materials hold critical components to PCBs, providing optimal circuit protection for manual applications such as wire tacking and coil termination.
Electronics Assembly
Camera Module

Camera Module


Camera module adhesives and light-curable materials are utilized for the assembly of camera modules found in smart connected devices and automobiles, as well as security and industrial camera systems. The materials cure in seconds upon exposure to light energy, providing greater product yields in a much shorter assembly time.
LEARN MORE
Camera Module

Camera Module


Camera module adhesives and light-curable materials are utilized for the assembly of camera modules found in smart connected devices and automobiles, as well as security and industrial camera systems. The materials cure in seconds upon exposure to light energy, providing greater product yields in a much shorter assembly time.
LEARN MORE
Conformal Coating

Conformal Coating


Conformal coatings are applied to electronic circuitry to act as protection against moisture, dust, chemicals, and temperature extremes that if uncoated (non-protected) could result in a complete failure of the electronic system.
LEARN MORE
Encapsulants

Encapsulants


Encapsulants cure in seconds upon exposure to UV and/or visible light to protect sensitive components on printed circuit boards including flip chips, wire bonds, bare die, and integrated circuits (IC).
LEARN MORE
Halogen Free

Halogen Free


When ignited, bromine and chlorine are known to emit toxic and corrosive gases. In 2003, standards created by the International Electromechanical Commission (IEC) were passed into law to eliminate concerns associated with end of life/disposal of devices containing these chemicals. Initial target areas include consumer electronics as well as household…
LEARN MORE
LED Protection

LED Protection


LIGHT CAP® LED protection encapsulants and coatings cure in seconds upon exposure to light energy, providing optimal protection of light emitting diodes. The products are able to endure higher temperatures, resist yellowing, and transmit more light than competing technologies.
LEARN MORE
Optical Display Bonding

Optical Display Bonding


Dymax light-curable optical display bonding adhesives are specifically formulated for applications where durable, crystal-clear, invisible bonds are required. Their fast, on-demand cure allows substrates to be repositioned precisely until parts are ready to be cured. One-part LCD adhesives are ideal for touch panel assembly including bonding flat panel displays, touch…
LEARN MORE
Peelable Maskants

Peelable Maskants


SpeedMask® peelable maskants for electronics cure in seconds "on demand" when exposed to UV/Visible light. The products are all one part, solvent free, and silicone free. Just one layer of masking material provides excellent protection of printed circuit and wiring boards during processing.
LEARN MORE
Peelable Maskants

Peelable Maskants


SpeedMask® peelable maskants for electronics cure in seconds "on demand" when exposed to UV/Visible light. The products are all one part, solvent free, and silicone free. Just one layer of masking material provides excellent protection of printed circuit and wiring boards during processing.
LEARN MORE
Potting Compounds

Potting Compounds


Potting compounds cure tack free in seconds upon exposure to UV/Visible light, replacing epoxy urethane and silicone potting materials. Shallow potting and sealing of electronic components and circuitry is possible in 10-30 seconds or less. Fast cure times allow for complete in-line processing and reduced work in progress.
LEARN MORE
Thermal Interface Materials

Thermal Interface Materials


Multi-Cure® thermal interface materials provide an efficient method of thermal transfer between heat sinks and electronics. The products cure in seconds with light, heat, or activator, providing cutting edge performance characteristics with maximum processing convenience.
LEARN MORE
Wire Tacking

Wire Tacking


Wire tacking and ruggedizing adhesives cure in seconds upon exposure to UV/Visible light energy to provide optimal protection of printed circuit board components. The "on demand" cure feature of the products makes them ideal for manual applications such as edge bonding and reinforcement, where precise placement and immediate strength is critical.
LEARN MORE