UV Curable Optical Assembly Adhesives

Low-Stress, Low-Movement, Light-Curable Optical Adhesives

Optical Assembly Adhesives

Dymax low-stress, low-movement, light-curable optical adhesives cure in seconds to provide the strength and clarity of epoxies. Optically clear, high-tensile-strength bonds of 3,000 psi and shrinkage as low as 0.1% are possible.

  • UV/Visible light cure in seconds
  • Optically clear adhesive with excellent light transmission properties
  • High strength optical adhesive
  • Low stress optical adhesive
  • Solvent free
  • Low shrinkage and low outgassing properties, result in no movement during cure
  • One component, no mixing is required

UV curable optical adhesives for optical assembly and lens bonding include grades for VCSEL potting, lens fixturing, lens laminating, lens positioning, and fiber-optic assembly. Dymax optically clear adhesives feature low-shrink, low-stress characteristics, are single component, and exhibit gap filling to 1/4".

OP series UV/Visible light cure optical adhesives are ideal for optical assembly applications such as lens and optical mounting and the attachment of ceramic, glass, quartz, metal, and plastic components.

Download  UV Light-Curable Lens-Bonding and Fiber Optic Adhesives Selector Guide

UV Curable Optical Assembly Adhesives Selector Guide

Applications: Light path, lens positioning, optical assembly
Features: High optical clarity; tenacious adhesion to glass and metal; moisture resistant optical adhesive; resists yellowing; low shrink on cure; Tg increases with heat exposure

Applications: Lens positioning, tacking, bonding, potting, sealing, and laminating
Features: Multipurpose; optically clear; resilient; low stress optical adhesive; resists yellowing, thermal shock, vibration, and impact; bonds glass, metal, and plastics; ideal for large or small areas

Applications: Optical assembly alignment where minimal or no movement is required
Features: High strength positioning; low outgassing optical adhesive; low shrinkage; no movement during cure or thermal excursions; complete cure in seconds; bonds to metal, glass, ceramic, FR-4, and polycarbonate