Thermal Interface Materials

Rapid Mounting of Heat-Sensitive Components on Printed Circuit Boards

Thermal Interface Materials

Dymax Multi-Cure® thermal interface materials may be cured with light, heat, or activator. Most applications utilize a combination of these methods for optimal cure speed. Light cure allows for exposed areas to cure immediately, fixturing parts in place so activator or heat can continue curing in shadowed areas without interruption to process flow.

Dymax thermal interface materials offer thermal conductivity levels as high as 0.9 W/m*K. They are high viscosity and highly thixotropic for optimal dispensing and material placement.

Halogen-Free Dymax Products Dymax has halogen-free formulations. We offer a wide variety of halogen-free coatings, adhesives, encapsulants, and potting materials.
Download  UV Curable Adhesives, Conformal Coatings and Encapsulants for Electronics Assembly Selector Guide
Download  Thermally Conductive Adhesives Application Bulletin
Download  Dymax Light-Curing Equipment Selector Guide
Download  Dispensing Equipment Selector Guide

Thermal Interface Materials (TIM) Selector Guide

Applications: Thermal interface adhesive
Features: Thermally conductive; 0.9 W/m*K; UV/Visible light cure for exposed areas in seconds; activator or heat cure shadowed areas; one part; solvent free; halogen-free

Applications: Activator
Features: Solvent-free activator; Low viscosity ideal for thin spray or brush applications