Dymax Multi-Cure® thermal interface materials may be cured with light, heat, or activator. Most applications utilize a combination of these methods for optimal cure speed. Light cure allows for exposed areas to cure immediately, fixturing parts in place so activator or heat can continue curing in shadowed areas without interruption to process flow.
Dymax thermal interface materials offer thermal conductivity levels as high as 0.9 W/m*K. They are high viscosity and highly thixotropic for optimal dispensing and material placement.
|Dymax has halogen-free formulations. We offer a wide variety of halogen-free coatings, adhesives, encapsulants, and potting materials.|
|UV Curable Adhesives, Conformal Coatings and Encapsulants for Electronics Assembly Selector Guide|
|Thermally Conductive Adhesives Application Bulletin|
|Dymax Light-Curing Equipment Selector Guide|
|Dispensing Equipment Selector Guide|