9309-SC Ruggedization Material for Printed Circuit Boards

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9309-SC Ruggedization Material for Printed Circuit Boards

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9309-SC Ruggedization Material for Printed Circuit Boards

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Dymax 9309-SC solvent- and halogen- free edgebond adhesive is designed for BGA and VGA applications where shock attenuation and ruggedizing of components on printed circuit boards is required. The product cures tack-free with UV/Visible light in seconds and is formulated with Dymax patented See-Cure technology.

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