Dispensing Equipment
Dymax manual and automated fluid dispense systems and spray valves are easily integrated into existing manufacturing processes for easy application of coatings, lubricants, or masking resins.
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Potting Compounds
Potting Compounds For Consumer Electronic Components
Dymax potting materials provide excellent protection for printed circuit board microelectronic components and circuitry. The PCB potting compounds cure in 10-30 seconds using UV or LED light which eliminates the need for fixtures, jigs, racks, and ovens. This means an increase in floor space and lower total inventory costs
In addition, Dymax PCB potting materials provide translucent bonds and are ideal for potting electronics, connectors, thermal switches, and sensors, tamper-proofing, and bridge bonding. The potting materials have excellent adhesion to metal, glass, ceramic, and many phenolic, filled, and thermoset plastics.
Features
- Cure with LED or UV/Visible light
- Full cure in 10-30 seconds
- Increased manufacturing floor space
- Lower inventory costs
- Replace epoxy and silicone materials
- Halogen-free formulations available
Product Number
Product Description
Regional Availability
6-621-VT
Industrial adhesive designed for coil winding, metal-to-glass bonding, and potting. This product cures with UV/Visible light, heat, or pre-applied activator.
6-621-GEL
Structural bonding adhesive cures upon exposure to UV/Visible light or heat. This product is designed for rapid assembling of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other materials.
Product Number
Product Description
Regional Availability
921-GEL
Rapid rigid adhesive and shallow potting (0.25 in/6mm) for a wide variety of substrates. This material is formulated to cure primarily with UV/Visible light and includes a secondary heat or activator cure function in applications with shadow areas.
921-T
High-strength resin for rigid adhesive bonds or potting of a wide variety of substrates. This resin cures clear and deep. This product can be cured with UV light, and shadow areas can be cured with heat.
921-VT
High-strength resin cures clear and deep. Suitable for when rigid adhesive bonds and potted areas are desired. This product cures with UV-light and heat or activator cure for shadow areas.
6-621-GEL-F
Fluorescing adhesive for fast assembly of components made of metal, glass, ceramic, phenolic, filled polyamide, and other substrate materials. This product cures rapidly upon exposure to UV/Visible light, heat, or pre-applied activator.
6-621-T
Structural bonding adhesive forms hard, clear bonds and rapidly cures with UV/Visible light, heat, or pre-applied activator. Common applications include metal-to-glass bonding, coil winding, and potting.
9001-E-V3.1
Light and heat-curable encapsulant & potting resin for electronic assembly and circuit boards where enhanced moisture and thermal cycling, and abrasion resistance are required. This material provides optimal coverage over difficult circuit geometries and minimizes stress on delicate wire bonds.
6-621
Metal bonding adhesive curable with UV/Visible light, heat, or pre-applied activator. Visible light can penetrate through many UV-blocked and colored plastics and glasses. Applications include coil winding, potting, as well as metal-to-glass bonding.
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